MC74LCX541DT ON Semiconductor, MC74LCX541DT Datasheet - Page 7

IC BUFF/DVR TRI-ST 8BIT 20TSSOP

MC74LCX541DT

Manufacturer Part Number
MC74LCX541DT
Description
IC BUFF/DVR TRI-ST 8BIT 20TSSOP
Manufacturer
ON Semiconductor
Series
74LCXr
Datasheet

Specifications of MC74LCX541DT

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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e
20
1
0.13 (0.005)
Z
b
M
D
0.10 (0.004)
10
11
E
A
H
E
A
1
PACKAGE DIMENSIONS
VIEW P
http://onsemi.com
MC74LCX541
CASE 967−01
SOEIAJ−20
M SUFFIX
M
ISSUE O
_
L
E
7
L
DETAIL P
Q
1
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
D
E
L
L
Q
Z
c
e
E
1
E
1
12.35
MILLIMETERS
MIN
0.05
0.35
0.18
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
12.80
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.81
_
0.002
0.014
0.007
0.486
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0
0.050 BSC
INCHES
_
0.081
0.008
0.020
0.504
0.215
0.323
0.033
0.059
0.035
0.032
MAX
0.011
10
_

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