74LVC2G07GM,132 NXP Semiconductors, 74LVC2G07GM,132 Datasheet - Page 2

IC BUFFER N-INV OP/DRAIN 6XSON

74LVC2G07GM,132

Manufacturer Part Number
74LVC2G07GM,132
Description
IC BUFFER N-INV OP/DRAIN 6XSON
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC2G07GM,132

Logic Type
Buffer/Line Driver, Non-Inverting with Open Drain
Number Of Elements
2
Number Of Bits Per Element
1
Current - Output High, Low
32mA, 32mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
6-XSON (Micropak™), SOT-886
Logic Family
LVC
Number Of Channels Per Chip
2
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Low Level Output Current
32 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
2 / 2
Output Type
Open Drain
Propagation Delay Time
2.6 ns at 3.3 V, 2.3 ns at 2.7 V, 1.5 ns at 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74LVC2G07GM-H
74LVC2G07GM-H
935277169132
NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC2G07
Product data sheet
Type number
74LVC2G07GW
74LVC2G07GV
74LVC2G07GM
74LVC2G07GF
74LVC2G07GN
74LVC2G07GS
Type number
74LVC2G07GW
74LVC2G07GV
74LVC2G07GM
74LVC2G07GF
74LVC2G07GN
74LVC2G07GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
1
3
Logic symbol
Ordering information
Marking
1A
2A
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
mnb092
1Y
2Y
6
4
SC-88
TSOP6
XSON6
XSON6
XSON6
XSON6
All information provided in this document is subject to legal disclaimers.
Fig 2.
1A
2A
Rev. 5 — 6 August 2010
IEC logic symbol
1
3
plastic extremely thin small outline package;
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
extremely thin small outline package; no leads;
Description
plastic surface-mounted package; 6 leads
plastic surface-mounted package (TSOP6); 6 leads
no leads; 6 terminals; body 1 × 1.45 × 0.5 mm
no leads; 6 terminals; body 1 × 1 × 0.5 mm
6 terminals; body 0.9 × 1.0 × 0.35 mm
6 terminals; body 1.0 × 1.0 × 0.35 mm
Marking code
V7
V07
V7
V7
V7
V7
mnb093
6
4
1Y
2Y
[1]
Fig 3.
Buffers with open-drain outputs
A
Logic diagram (one driver)
74LVC2G07
© NXP B.V. 2010. All rights reserved.
GND
Y
Version
SOT363
SOT457
SOT886
SOT891
SOT1115
SOT1202
mna591
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