BC850C Infineon Technologies, BC850C Datasheet - Page 12

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BC850C

Manufacturer Part Number
BC850C
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of BC850C

Packages
SOT23
Polarity
NPN
Vceo (max)
45.0 V
Vcbo (max)
50.0 V
Ic(max)
100.0 mA
Icm (max)
200.0 mA

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Package Outline
Foot Print
For board assembly information please refer to Infineon website "Packages"
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
1
2
3
0.225
Pin 1
marking
1) Dimension applies to plated terminal
Top view
0.15
Copper
Pin 1
marking
0.6
0.225
0.05 MAX.
Package TSLP-3-1
Solder mask
0.76
0.4
4
+0.1
12
2 x 0.15
0.5
0.35
±0.035
±0.035
0.2
0.17
±0.05
Stencil apertures
1)
Bottom view
3
2
0.2
1)
0.5
0.6
BFR193L3
Type code
Pin 1 marking
Laser marking
0.45
±0.05
1
R0.1
BC847...-BC850...
2011-09-09

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