... Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment Edited by INFINEON Technologies HV3, L 7371M, Edition 2, 04.09.2003 SIGC185T170R2C This chip is used for: IGBT-Module BSM100GB170DL Applications: drives I Die Size Cn 2 13.56 x 13. ...
... SWITCHING CHARACTERISTICS (tested at component), Inductive Load: Parameter Turn-on delay time Rise time Turn-off delay time Fall time 1) values also influenced by parasitic L- and C- in measurement and package. Edited by INFINEON Technologies HV3, L 7371M, Edition 2, 04.09.2003 SIGC185T170R2C Symbol jmax C I jmax ...
... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 7371M, Edition 2, 04.09.2003 SIGC185T170R2C BSM100GB170DL Half-Bridge ...