BSV236SP Infineon Technologies, BSV236SP Datasheet - Page 2

• Manufacturer Part Number: BSV236SP
• Manufacturer: Infineon Technologies

Specifications of BSV236SP

• Package: SOT-363
• Vds (max): -20.0 V
• Rds (on) (max) (@10v): -
• Rds (on) (max) (@4.5v): 175.0 mOhm
• Rds (on) (max) (@2.5v): 285.0 mOhm

Electrical Characteristics, at T
Parameter
Static Characteristics
Drain-source breakdown voltage
V
Gate threshold voltage, V
I
Zero gate voltage drain current
V
V
Gate-source leakage current
V
Drain-source on-state resistance
V
Drain-source on-state resistance
V
1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air; t 10 sec.
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - soldering point
SMD version, device on PCB:
@ min. footprint
@ 6 cm
D
Rev 1.5
GS
DS
DS
GS
GS
GS
=-8µA
=-20V, V
=-20V, V
=0, I
=-12V, V
=-2.5V, I
=-4.5, I
2
D
cooling area
=-250µA
D
GS
GS
D
=-1.5A
DS
=-0.8A
=0, T
=0, T
=0
j
j
=25°C
=150°C
1)
GS
= V
j
DS
= 25 °C, unless otherwise specified
Page 2
Symbol
V
V
I
I
R
R
Symbol
R
R
DSS
GSS
(BR)DSS
GS(th)
DS(on)
DS(on)
thJS
thJA
min.
min.
-0.6
-20
-
-
-
-
-
-
-
-
Values
Values
-0.1
typ.
-0.9
-10
193
131
typ.
-10
-
-
-
-
max.
BSV 236SP
max.
-100
-100
220
110
-1.2
285
175
90
2011-07-14
-1
-
Unit
V
µA
nA
m
Unit
K/W