BSD314SPE H6327 Infineon Technologies, BSD314SPE H6327 Datasheet

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BSD314SPE H6327

Manufacturer Part Number
BSD314SPE H6327
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of BSD314SPE H6327

Package
SOT-363
Vds (max)
-30.0 V
Rds (on) (max) (@10v)
140.0 mOhm
Rds (on) (max) (@4.5v)
230.0 mOhm
Rds (on) (max) (@2.5v)
-
Rev 2.2
Features
• P-channel
• Enhancement mode
• Logic level (4.5V rated)
• ESD protected
• Qualified according AEC Q101
• 100% Lead-free; RoHS compliant
• Halogen-free according to IEC61249-2-21
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
ESD Class
Soldering Temperature
IEC climatic category; DIN IEC 68-1
OptiMOS™-P 3 Small-Signal-Transistor
Type
BSD314SPE
Package
PG-SOT-363 L6327: 3000 pcs/ reel
1)
j
=25 °C, unless otherwise specified
Tape and Reel Information
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
stg
T
T
T
I
I
V
di /dt =-200A/µs,
T
T
D
D
JESD22-A114 -HBM
page 1
A
A
A
j,max
A
DS
=-1.5A, R
=-1.5 A,
=25 °C
=70 °C
=25 °C
=25 °C
=-16V,
=150 °C
GS
=25 Ω
V
R
I
Product Summary
D
DS
DS(on),max
Marking
XDs
V
V
2 (2kV to 4kV)
GS
GS
Lead Free
Yes
-55 ... 150
55/150/56
=-10 V
=-4.5 V
260 °C
Value
-1.5
-1.2
-6.1
±20
0.5
PG-SOT-363
6
6
1
2
6
BSD314SPE
3
Packing
Non dry
140
230
-1.5
30
5
4
Unit
A
mJ
kV/µs
V
W
°C
°C
°C
V
A
2011-07-14

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BSD314SPE H6327 Summary of contents

Page 1

OptiMOS™-P 3 Small-Signal-Transistor Features • P-channel • Enhancement mode • Logic level (4.5V rated) • ESD protected • Qualified according AEC Q101 • 100% Lead-free; RoHS compliant • Halogen-free according to IEC61249-2-21 Type Package BSD314SPE PG-SOT-363 L6327: 3000 pcs/ reel ...

Page 2

Parameter Thermal characteristics Thermal resistance, junction - ambient Electrical characteristics Static characteristics Drain-source breakdown voltage Gate threshold voltage Drain-source leakage current Gate-source leakage current Drain-source on-state resistance Transconductance 1) 2 Performed on 40mm FR4 PCB. The traces are ...

Page 3

Parameter Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode ...

Page 4

Power dissipation P =f(T ) tot A 0.5 0.375 0.25 0.125 Safe operating area I =f =25 ° parameter ...

Page 5

Typ. output characteristics I =f =25 ° parameter 4 Typ. transfer characteristics I ...

Page 6

Drain-source on-state resistance R =f =-1 DS(on 250 200 98 % 150 100 50 0 -60 - Typ. capacitances C =f MHz; T ...

Page 7

Avalanche characteristics =25 Ω parameter: T j(start Drain-source breakdown voltage V =f =-250 µA BR(DSS ...

Page 8

Package Outline: Footprint: Reflow soldering: Rev 2.2 SOT-363 Packing: page 8 BSD314SPE 2011-07-14 ...

Page 9

... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system ...

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