BSP170P Infineon Technologies, BSP170P Datasheet
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BSP170P
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BSP170P Summary of contents
Page 1
... Operating and storage temperature ESD class Soldering temperature IEC climatic category; DIN IEC 68-1 Rev 2.52 Product Summary DS(on),max I D Tape and reel information Marking L6327: 1000pcs/reel BSP170P Yes Symbol Conditions I T =25 ° =70 ° =25 °C D,pulse A =25 Ω ...
Page 2
... GSS =- =-1.9 A DS(on |>2 DS(on)max =-1 (one layer, 70µm thick) copper area for drain connection. PCB page 2 BSP170P Values Unit min. typ. max K 110 -0.1 -1 µA - -10 -100 ...
Page 3
... plateau =25 ° S,pulse =-1 =25 ° = =| /dt =100 A/µ page 3 BSP170P Values Unit min. typ. max. - 328 410 pF - 105 135 - 138 - -1.4 -1 -4.9 -7.4 - ...
Page 4
... A 4 Max. transient thermal impedance Z =f(t thJA p parameter µs 100 µ 100 100 10 [V] DS page 4 BSP170P |≥ 120 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - ...
Page 5
... V 300 200 -4V 100 [ Typ. forward transconductance g =f 3.5 3 2.5 2 1.5 1 0.5 125 °C 25 ° [V] GS page 5 BSP170P ); T =25 ° -4 -5 - [A] D =25 °C j 0 [A] D 2.5 2008-03-26 ...
Page 6
... Forward characteristics of reverse diode I =f parameter Ciss 0 10 Coss Crss - [V] DS page 6 BSP170P ); =-250 µ max. typ. min. - 100 T [° 150 °C, typ 25 °C, 98% 150 °C, 98% 25 °C, typ 0 ...
Page 7
... T Rev 2.52 14 Typ. gate charge V =f(Q GS parameter °C 8 100 °C 125 ° [µ 100 140 [°C] j page 7 BSP170P ); I =-1.9 A pulsed gate [nC] gate 15 2008-03-26 ...
Page 8
... Package Outline SOT-223: Outline Footprint Operating and storage temperature Dimensions in mm Rev 2.52 Packaging Tape page 8 BSP170P 2008-03-26 ...
Page 9
... Rev 2.52 page 9 BSP170P 2008-03-26 ...