BSR315P Infineon Technologies, BSR315P Datasheet

no-image

BSR315P

Manufacturer Part Number
BSR315P
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of BSR315P

Package
SC59
Vds (max)
-60.0 V
Rds (on) (max) (@10v)
800.0 mOhm
Rds (on) (max) (@4.5v)
1,300.0 mOhm
Rds (on) (max) (@2.5v)
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSR315P
Manufacturer:
Infineon
Quantity:
35 000
Part Number:
BSR315P
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Company:
Part Number:
BSR315P H6327
Quantity:
9 000
Part Number:
BSR315PH6327XTSA1
Manufacturer:
INFINEON
Quantity:
12 000
Part Number:
BSR315PL6327
Manufacturer:
INFINEON
Quantity:
12 000
Rev 1.05
SIPMOS
Features
• P-Channel
• Enhancement mode
• Logic level
• Footprint and pinning compatible with SOT-23 / SuperSOT-23 packages
• Avalanche rated
• Pb-free lead finishing; RoHS compliant
• Qualified according to AEC Q101
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
ESD class
Soldering temperature
IEC climatic category; DIN IEC 68-1
Type
BSR315P
®
Small-Signal-Transistor
Package
PG-SC59
j
=25 °C, unless otherwise specified
Tape and reel information
L6327 = 3000 pcs. / reel
Symbol Conditions
I
I
E
V
P
T
D
D,pulse
AS
GS
tot
j
, T
stg
T
T
T
I
T
JESD22-C101
D
A
A
A
A
=0.62 A, R
page 1
=25 °C
=70 °C
=25 °C
=25 °C
GS
Product Summary
V
R
I
D
DS
DS(on),max
=25 W
Marking
LB
1A (250V to 500V)
steady state
Lead free
Yes
-55 ... 150
55/150/56
260 °C
Value
-0.62
-0.49
-2.48
±20
0.5
24
SC-59
Packing
Non dry
-0.62
0.8
-60
BSR315P
2012-03-15
Unit
A
mJ
V
W
°C
V
W
A

Related parts for BSR315P

BSR315P Summary of contents

Page 1

... =25 °C D,pulse A = =0. =25 °C tot stg JESD22-C101 page 1 BSR315P -60 0.8 -0.62 SC-59 Marking Lead free Packing LB Yes Non dry Value steady state -0.62 -0.49 -2.48 24 ±20 0.5 -55 ... 150 1A (250V to 500V) 260 °C 55/150/56 2012-03- Unit ...

Page 2

... GSS =-4 DS(on) I =-0. =- =-0. |>2 DS(on)max =-0. page 2 Values min. typ. max 250 - -1 -0 -10 -100 = -10 -100 - 870 1300 - 620 800 , 0.5 0.9 - BSR315P Unit K/W V µ 2012-03-15 ...

Page 3

... plateau =25 ° S,pulse =-0. =25 ° =- =| /dt =100 A/µ page 3 BSR315P Values Unit min. typ. max. - 132 176 0.4 0 ...

Page 4

... Max. transient thermal impedance Z =f(t thJA parameter µs 100 µ 100 100 10 [V] page 4 |≥ 120 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p BSR315P 160 2012-03-15 ...

Page 5

... V 1000 900 -3.5 V 800 700 -3 V 600 -2.5 V 500 [V] 8 Typ. forward transconductance g =f 1 [V] page =25 ° -3 - [A] D =25 ° 0.5 1 1.5 -I [A] D BSR315P -4 2.5 2012-03-15 ...

Page 6

... Forward characteristics of reverse diode I =f parameter Ciss 10 -1 Coss Crss - [V] page =-160 µ max. typ. min. -60 - 100 T [° °C, typ 150 °C, typ 0 150 °C, 98% 25 °C, 98 [V] SD BSR315P 140 1.5 2012-03-15 ...

Page 7

... Typ. gate charge V =f(Q GS parameter °C 8 100 °C 125 ° 100 1000 16 Gate charge waveforms V V gs(th) Q g(th) 60 100 140 page =-0.62 A pulsed gate [nC] gate BSR315P gate 2012-03-15 ...

Page 8

... Package Outline SC-59: Outline Footprint Packaging Tape Dimensions in mm Rev 1.05 page 8 BSR315P 2012-03-15 ...

Page 9

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev 1.05 page 9 BSR315P 2012-03-15 ...

Related keywords