BSD235N Infineon Technologies, BSD235N Datasheet
BSD235N
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BSD235N Summary of contents
Page 1
... =0. = /dt di /dt =200 A/µs, =150 °C T j,max V GS =25 ° tot stg JESD22-A114 -HBM page 1 BSD235N 20 V =4.5 V 350 mΩ =2.5 V 600 V GS 0.95 A PG-SOT-363 Lead Free Packing Yes Non dry Value Unit ...
Page 2
... =150 ° = GSS =0. DS(on =4 =0. |>2 DS(on)max g fs =0. page 2 BSD235N Values Unit min. typ. max 250 K 0.7 0.95 1.2 μ 100 - - 100 nA - 415 600 mΩ - 266 350 , 2011-07-14 ...
Page 3
... = =0. 4 plateau I S =25 ° S,pulse = =0. =25 ° = =0. /dt =100 A/µ page 3 BSD235N Values Unit min. typ. max 0.5 A ...
Page 4
... T [° Max. transient thermal impedance =f(t Z thJA p parameter 100 µ [V] DS page 4 BSD235N ≥4 120 T [° 0.5 0.2 0.1 0.05 0.01 single pulse - [s] ...
Page 5
... V 400 300 2.5 V 200 2.3 V 100 [ Typ. forward transconductance =f °C 2 150 ° [V] GS page 5 BSD235N ); T =25 ° 2 3 [A] D =25 ° [ 2011-07-14 ...
Page 6
... Forward characteristics of reverse diode =25°C =f parameter Ciss 0 10 Coss -1 10 Crss - [V] DS page 6 BSD235N ); =1.6 µ typ 100 140 T [° 150 °C, 98% 25 °C 25 °C, 98% 150 °C 0.4 0.8 1.2 V ...
Page 7
... °C 4 100 °C 125 ° [µs] 16 Gate charge waveforms s(th) Q g(th) 60 100 140 [°C] j page 7 BSD235N ); I =0.95 A pulsed 0.1 0.2 0.3 0.4 Q [nC] gate 0.5 g ate 2011-07-14 ...
Page 8
... Package Outline: Footprint: Reflow soldering: Dimensions in mm Rev 2.3 SOT-363 Packing: page 8 BSD235N 2011-07-14 ...
Page 9
... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev 2.3 page 9 BSD235N 2011-07-14 ...