TMP86xy09NG Toshiba, TMP86xy09NG Datasheet - Page 149

• Manufacturer Part Number: TMP86xy09NG
• Manufacturer: Toshiba

Specifications of TMP86xy09NG

• Package: SDIP32
• Rom Types (m=mask,p=otp,f=flash): M/F
• Rom Size: 8/16
• Ram Size: 256/512
• Driver Led: 8
• Driver Lcd: -
• Spi/sio Channels: 1
• Uart/sio Channels: 1
• I2c/sio Channels: -
• High-speed Serial Output: -
• Adc 8-bit Channels: -
• Adc 10-bit Channels: 6
• Da Converter Channels: -
• Timer Counter 18-bit Channel: -
• Timer Counter 16-bit Channel: 1
• Timer Counter 8-bit Channel: 2
• Motor Channels: -
• Watchdog Timer: √
• Dual Clock: √
• Clock Gear: -
• Number Of I/o Ports: 26
• Power Supply (v): 2.7 to 5.5

15.6 Recommended Oscillating Conditions
15.7 Handling Precaution
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors are
Note 2: The product numbers and specifications of the resonators by Murata Manufacturing Co., Ltd. are subject to change. For
- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown
-
below.
1. When using the Sn-37Pb solder bath
2. When using the Sn-3.0Ag-0.5Cu solder bath
When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend elec-
trically shielding the package in order to maintain normal operating condition.
greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will actually be
mounted.
up-to-date information, please refer to the following URL:
http://www.murata.com
Note:
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
The pass criteron of the above test is as follows:
C
(1) High-frequency Oscillation
1
XIN
Solderability rate until forming ≥ 95 %
XOUT
C
2
Page 139
C
(2) Low-frequency Oscillation
1
XTIN
XTOUT
C
2
TMP86C809NG