74HCT125N,652 NXP Semiconductors, 74HCT125N,652 Datasheet - Page 21
74HCT125N,652
Manufacturer Part Number
74HCT125N,652
Description
IC BUFFER DVR TRI-ST QD 14PDIP
Manufacturer
NXP Semiconductors
Series
74HCTr
Datasheets
1.74HCT4046ADB112.pdf
(19 pages)
2.74HCT4046ADB112.pdf
(23 pages)
3.74HCT125D653.pdf
(6 pages)
Specifications of 74HCT125N,652
Package / Case
14-DIP (0.300", 7.62mm)
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
1
Current - Output High, Low
6mA, 6mA
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Through Hole
Logic Family
74HCT
Number Of Channels Per Chip
4
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
High Level Output Current
- 6 mA
Input Bias Current (max)
8 uA
Low Level Output Current
6 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
12 ns
Number Of Lines (input / Output)
4 / 4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-1510-5
74HCT125N
933757000652
74HCT125N
933757000652
Philips Semiconductors
January 1996
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Package outline drawings
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.10
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
(1)
w
E
4.5
4.3
M
(2)
scale
EIAJ
2.5
0.65
21
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
1.0
L
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
X
v
0.1
A
y
M
ISSUE DATE
A
94-07-12
95-04-04
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o