74AUP2G34GW,125 NXP Semiconductors, 74AUP2G34GW,125 Datasheet - Page 12

• Manufacturer Part Number: 74AUP2G34GW,125
• Description: IC BUFF DL LOW PWR N-INV SC88
• Manufacturer: NXP Semiconductors
• Series: 74AUPr

Specifications of 74AUP2G34GW,125

• Package / Case: SC-70-6, SC-88, SOT-363
• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 0.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: AUP
• Number Of Channels Per Chip: 2
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 0.8 V
• Maximum Operating Temperature: 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 4 mA
• Low Level Output Current: 4 mA
• Maximum Power Dissipation: 250 mW
• Minimum Operating Temperature: - 40 C
• Propagation Delay Time: 20.8 ns
• Number Of Lines (input / Output): 2 / 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2581-2; 935279993125

NXP Semiconductors
Fig 10. Package outline SOT886 (XSON6)
74AUP2G34
Product data sheet
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
UNIT
mm
VERSION
OUTLINE
SOT886
max
A
0.5
(1)
max
0.04
A
terminal 1
index area
1
e
0.25
0.17
b
6×
(2)
L
1
IEC
1.5
1.4
D
1.05
0.95
1
6
E
0
e
MO-252
JEDEC
1
0.6
All information provided in this document is subject to legal disclaimers.
e
REFERENCES
D
0.5
2
5
e
Rev. 3 — 3 September 2010
1
e
0.35
0.27
1
L
JEITA
b
0.40
0.32
scale
L
3
4
1
1
A
L
1
E
A
4×
(2)
2 mm
PROJECTION
EUROPEAN
74AUP2G34
Low-power dual buffer
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
04-07-15
04-07-22
SOT886
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