74AUP1G34GW,125 NXP Semiconductors, 74AUP1G34GW,125 Datasheet - Page 2

IC BUFFER LOW PWR N-INV 5TSSOP

74AUP1G34GW,125

Manufacturer Part Number
74AUP1G34GW,125
Description
IC BUFFER LOW PWR N-INV 5TSSOP
Manufacturer
NXP Semiconductors
Series
74AUPr
Datasheet

Specifications of 74AUP1G34GW,125

Package / Case
SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
1
Current - Output High, Low
4mA, 4mA
Voltage - Supply
0.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
AUP
Number Of Channels Per Chip
1
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
0.8 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 4 mA
Low Level Output Current
4 mA
Maximum Power Dissipation
250 mW
Minimum Operating Temperature
- 40 C
Output Current
20 mA
Output Voltage
4.6 V
Propagation Delay Time
16.3 ns @ 1.1 V to 1.3 V or 10.3 ns @ 1.4 V to 1.6 V or 8.1 ns @ 1.65 V to 1.95 V or 6.4 ns @ 2.3 V to 2.7 V or 5.6 ns @ 3 V to 3.6 V
Number Of Lines (input / Output)
1 / 1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2565-2
935279028125
NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74AUP1G34
Product data sheet
Type number
74AUP1G34GW
74AUP1G34GM
74AUP1G34GF
Type number
74AUP1G34GW
74AUP1G34GM
74AUP1G34GF
74AUP1G34GN
74AUP1G34GS
74AUP1G34GN
74AUP1G34GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Logic symbol
2
Ordering information
Marking
A
001aac538
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
TSSOP5
XSON6
XSON6
XSON6
XSON6
Rev. 4 — 14 July 2010
IEC logic symbol
2
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1.45  0.5 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1  0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
001aac537
Marking code
aN
aN
aN
aN
aN
4
[1]
Fig 3.
A
Logic diagram
74AUP1G34
Low-power buffer
© NXP B.V. 2010. All rights reserved.
001aac536
Version
SOT353-1
SOT886
SOT891
SOT1115
SOT1202
Y
2 of 19

Related parts for 74AUP1G34GW,125