TDA9885TS/V5,118 NXP Semiconductors, TDA9885TS/V5,118 Datasheet - Page 52

• Manufacturer Part Number: TDA9885TS/V5,118
• Description: IC IF-PLL DEMOD I2C-BUS 24-SSOP
• Manufacturer: NXP Semiconductors
• Type: Demodulatorr

Specifications of TDA9885TS/V5,118

• Package / Case: *
• Applications: TV
• Mounting Type: Surface Mount
• Product: General Purpose Audio Amplifiers
• Available Set Gain: 66 dB
• Thd Plus Noise: 0.15 %, 0.5 %
• Operating Supply Voltage: 5 V
• Supply Current: 63 mA
• Maximum Power Dissipation: 305 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 10 KOhms, 100 KOhms
• Input Bias Current (max): 2 mA, 1.15 mA
• Minimum Operating Temperature: - 20 C
• Output Signal Type: Differential
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935286735118; TDA9885TS/V5-T; TDA9885TS/V5-T

NXP Semiconductors
TDA9885_TDA9886_3
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 24.
Table 25.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 24
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
I
2
C-bus controlled multistandard alignment-free IF-PLL demodulators
25
Rev. 03 — 16 December 2008
30.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
TDA9885; TDA9886
30) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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