IP4773CZ14,118 NXP Semiconductors, IP4773CZ14,118 Datasheet
IP4773CZ14,118
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IP4773CZ14,118 Summary of contents
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IP4773CZ14 VGA Interface with integrated buffer, ESD protection and termination resistor Rev. 01 — 24 February 2009 1. General description The IP4773CZ14 is a VGA or DVI-I interface intended to be connected between a video transmitter such ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Name IP4773CZ14 SSOP14 5. Functional diagram Fig 1. 6. Pinning information 6.1 Pinning Fig 2. IP4773CZ14_1 Product data sheet Description plastic shrink small outline package; 14 leads; body width 5 CC(VIDEO) VIDEO_1 VIDEO_2 VIDEO_3 GND BYP ...
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... NXP Semiconductors 6.2 Pin description Table 2. Symbol VIDEO_1 VIDEO_2 VIDEO_3 SYNC_IN1 SYNC_IN2 DDC_IN1 DDC_IN2 BYP V CC(SYNC) GND SYNC_OUT2 SYNC_OUT1 GND V CC(VIDEO) 7. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V video supply voltage CC(VIDEO) ...
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... NXP Semiconductors 8. Characteristics Table 4. Characteristics unless otherwise specified. amb Symbol Parameter Analog video (RGB) I supply current on pin CC(VIDEO) V CC(VIDEO) C channel capacitance ch I input current I V diode forward voltage Fd DDC C channel capacitance ch I input current I V diode forward voltage Fd Sync buffer ...
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... NXP Semiconductors 9. Application information 9.1 Connections The IP4773CZ14 should be placed as close as possible to the VGA or DVI-I interface connector. The ESD-protected channels on pins VIDEO_1, VIDEO_2 and VIDEO_3 can be connected in any order signals. The sync buffers are equivalent and can be connected to either h-sync or v-sync signals. ...
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... NXP Semiconductors RED GREEN BLUE HSYNC VSYNC DDC_Clock DDC_Data Fig 4. Receiver application The receiver application simplifies VGA input circuit applications. IP4773CZ14_1 Product data sheet VIDEO_1 V CC(VIDEO) VIDEO_2 VIDEO_3 BYP SYNC_IN1 SYNC_OUT1 IP4773CZ14 SYNC_IN2 SYNC_OUT2 DDC_IN1 DDC_IN2 V CC(SYNC) GND Rev. 01 — 24 February 2009 ...
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... NXP Semiconductors 10. Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 5 ...
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... NXP Semiconductors 11. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 11.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 11.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 6. For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 12. Abbreviations Table 7. Acronym DDC DVI-I EMI ESD RGB RFI TTL VGA 13. Revision history Table 8. Revision history Document ID Release date IP4773CZ14_1 20090224 IP4773CZ14_1 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 16. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Application information 9.1 Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Soldering of SMD packages . . . . . . . . . . . . . . . 8 11.1 Introduction to soldering . . . . . . . . . . . . . . . . . . 8 11.2 Wave and refl ...