IP4790CZ38,118 NXP Semiconductors, IP4790CZ38,118 Datasheet
IP4790CZ38,118
Specifications of IP4790CZ38,118
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IP4790CZ38,118 Summary of contents
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IP4790CZ38 DisplayPort protection Rev. 01 — 14 July 2008 1. General description The IP4790CZ38 is a single chip ElectroStatic Discharge (ESD) protection solution for the DisplayPort interfaces. The low capacitance, typically 0 ground, supports the high data rates ...
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... NXP Semiconductors 5. Functional diagram Fig 1. 6. Pinning information 6.1 Pinning Fig 2. IP4790CZ38_1 Product data sheet ML_0A ML_1A BIAS_CAP ML_0B ML_1B BIAS_CAP BIAS_CAP HOT_PLUG AUX_A GND Functional diagram VBIAS 1 GND 2 3 ML_0A n.c. 4 GND 5 6 ML_1A n.c. 7 GND 8 ML_2A 9 IP4790CZ38 10 n.c. GND ...
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... NXP Semiconductors 6.2 Pin description Table 2. Symbol VBIAS GND ML_0A n.c. GND ML_1A n.c. GND ML_2A n.c. GND ML_3A n.c. GND n.c. HOT_PLUG AUX_B AUX_A n.c. GND ML_3B n.c. GND ML_2B n.c. GND ML_1B n.c. GND ML_0B n.c. GND BIAS_CAP IP4790CZ38_1 ...
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... NXP Semiconductors 7. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V electrostatic discharge voltage ESD V voltage on pin VBIAS VBIAS T storage temperature stg P total power dissipation tot [1] Human Body Model (HBM) according IEC 61000-4-2, level 4. ...
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... NXP Semiconductors 9. Application information The IP4790CZ38 simplifies the protection of an DisplayPort interface. VBIAS Fig 3. Connecting an optional 100 nF capacitor to the BIAS_CAP pin (lead 38) enhances the ESD protection clamping performance. The VBIAS pin reduces the capacitive load of the ESD protection and V IP4790CZ38_1 ...
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... NXP Semiconductors 10. Package outline TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors 11. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 11.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 11.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 5. For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 12. Revision history Table 7. Revision history Document ID Release date IP4790CZ38_1 20080714 IP4790CZ38_1 Product data sheet maximum peak temperature = MSL limit, damage level temperature ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering of SMD packages . . . . . . . . . . . . . . . 7 11.1 Introduction to soldering . . . . . . . . . . . . . . . . . . 7 11.2 Wave and reflow soldering . . . . . . . . . . . . . . . . 7 11 ...