STAC2932F STMicroelectronics, STAC2932F Datasheet
STAC2932F
Related parts for STAC2932F
STAC2932F Summary of contents
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... In compliance with the 2002/95/EC European directive ■ ST air cavity packaging technology - STAC package Description The STAC2932F is a gold metallized N-channel MOS field-effect RF power transistor, intended for use large signal applications up to 250 MHz. The STAC2932F benefits from the latest generation of efficient, patent-pending package technology, otherwise known as STAC Table 1 ...
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... Contents Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 12 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 Doc ID 17120 Rev 3 STAC2932F ...
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... STAC2932F 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (T Symbol (1) V Drain source voltage (BR)DSS V Drain-gate voltage (R DGR V Gate-source voltage GS I Drain current D P Power dissipation DISS T Max. operating junction temperature J T Storage temperature STG 150 °C J 1.2 Thermal data Table 3. ...
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... I = 250 MHz DS Test conditions = 2 x 250 mA 175 MHz 250 mA 175 MHz DQ IN Doc ID 17120 Rev 3 STAC2932F Min. Typ. Max. Unit 125 V μA 50 250 nA 1.5 2.5 4 468 pF 206 Min ...
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... STAC2932F 3 Impedance Figure 2. Current conventions Table 6. Impedance data Freq. (MHz) 175 MHz Note: Measured gate to gate and drain to drain, respectively. Z (Ω) IN 2.0 - j2.0 Doc ID 17120 Rev 3 Impedance Z (Ω) DL 3.5 + j5.2 5/14 ...
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... Typical performance 4 Typical performance Figure 3. Capacitances vs drain supply voltage Figure 5. Output power vs gate voltage 6/14 Figure 4. Output power vs drain supply voltage Figure 6. Output power vs input power Doc ID 17120 Rev 3 STAC2932F ...
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... STAC2932F Figure 7. Output power vs input power and case temperature Figure 8. Efficiency vs output power and case temperature Doc ID 17120 Rev 3 Typical performance 7/14 ...
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... ST406 variable capacitor 47 pF ATC 100B chip capacitor 43 pF ATC 100B chip capacitor 470 pF ATC 100B chip capacitor 10,000 pF ATC 200B chip capacitor .1 μF 200 V chip capacitor 10 μF 100 V electrolytic capacitor . variable capacitor 430 Ω, 1/2 W chip resistor Doc ID 17120 Rev 3 STAC2932F ...
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... STAC2932F Table 7. 175 MHz part list (continued) Component R3 FB1,FB5 FB2, FB6 FB3, FB4 PCB Figure 10. Circuit layout Description 270 Ω 1/2 W axial lead resistor RG-316 50 Ω 11.8" thru ferrite toroid RG-142 50 Ω 11.8" 4:1, RG-316 25 Ω , 5.9", 2 turns thru ferrite core 1:4, 25 Ω ...
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... STAC244F package dimensions Dim 10/14 mm. Min Max 5.10 5.59 4.32 4.83 4.32 5.33 9.65 9.91 19.61 20.02 20.45 20.70 0.08 1.15 0.89 1.14 1.45 1.70 3.18 4.32 9.27 9.53 Doc ID 17120 Rev 3 STAC2932F Inch Min Max 200 220 170 190 170 210 380 390 772 788 805 815 .003 .006 .035 .045 .057 .067 .125 .170 .365 .375 ...
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... STAC2932F Figure 11. Package dimensions Doc ID 17120 Rev 3 Package mechanical data 11/14 ...
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... MAR 12/14 Packaging Pcs per tray Tray 20 Description Wafer process code Assembly plant Last 3 digit of diffusion lot Diffusion plant Country of origin Test and finishing plant Assembly year Assembly week Doc ID 17120 Rev 3 STAC2932F Dry pack Lot code humidity < Not mixed ...
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... STAC2932F 8 Revision history Table 11. Document revision history Date 12-Feb-2010 29-Jun-2010 12-Jan-2012 Revision 1 First release. 2 Updated features and description on cover page. Inserted Section 7: Marking, packing and shipping 3 Minor text changes. Doc ID 17120 Rev 3 Revision history Changes specifications. 13/14 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 14/14 Please Read Carefully: © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 17120 Rev 3 STAC2932F ...