STBV32 STMicroelectronics, STBV32 Datasheet
STBV32
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STBV32 Summary of contents
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... It uses a cellular emitter structure with planar edge termination to enhance switching speeds while maintaining the wide RBSOA. The STBV32G and STBV32G-AP are supplied using halogen-free molding compound. Table 1. Device summary Order codes ...
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... Table 3. Thermal data Symbol R Thermal resistance junction-case__________max thj-case 2/11 Parameter = < 0.5A °C) C < 5 ms) P < °C c Parameter STBV32 Value Unit 700 V 400 (BR)EBO 1 0.5 A 1.5 A 1.5 W -65 to 150 °C 150 Value Unit 83.3 °C/W ...
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... STBV32 2 Electrical characteristics ( °C; unless otherwise specified) case Electrical characteristics Table 4. Symbol Collector cut-off current I CES ( Emitter-base breakdown V (BR)EBO voltage (I Collector-emitter sustaining (1) V CEO(sus) voltage (I Collector-emitter saturation (1) V CE(sat) voltage Base-emitter saturation (1) V BE(sat) voltage h DC current gain FE Resistive load ...
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... Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 4. Output characteristics Figure 6. DC current gain 4/11 Figure 3. Derating curve Figure 5. Reverse biased safe operating area Figure 7. DC current gain STBV32 ...
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... STBV32 Figure 8. Collector-emitter saturation voltage Figure 10. Inductive load switching time Figure 11. Resistive load switching time Electrical characteristics Figure 9. Base-emitter saturation voltage 5/11 ...
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... Electrical characteristics 2.2 Test circuits Figure 12. Resistive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor Figure 13. Inductive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor 3) Fast recovery rectifier 6/11 STBV32 ...
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... STBV32 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Package mechanical data DIM 8/11 TO-92 bulk shipment mechanical data mm. MIN. TYP 4.32 0.36 4.45 3.30 2.41 1.14 12.70 2.16 0.92 0. STBV32 MAX. 4.95 0.51 4.95 3.94 2.67 1.40 15.49 2.41 1.52 0.56 0102782 D ...
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... STBV32 TO-92 ammopack shipment (suffix”-AP”) mechanical data Dim F1,F2 F3 delta delta P mm Min Typ 12.50 12.70 5.65 6.35 2.44 2.54 4.98 5.08 -2.00 17.50 18.00 5.70 6.00 8.50 9.00 18.50 0.5 1 15.50 16.00 3.80 4.00 3.00 -1.00 Package mechanical data Max 4.80 3.80 1.60 2.30 0.48 12.90 7.05 2.94 5.48 2.00 19.00 6.30 9.25 0.50 20.50 1.5 16.50 25.00 4.20 0.90 11.00 1.00 0050910S 9/11 ...
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... Revision history 4 Revision history Table 5. Document revision history Date 02-Jul-2008 10/11 Revision 8 Added halogen-free molding compound package. STBV32 Changes ...
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... STBV32 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...