TN1215 STMicroelectronics, TN1215 Datasheet - Page 5

• Manufacturer Part Number: TN1215
• Description: 12A standard SCRs
• Manufacturer: STMicroelectronics

TN1215, TS1220, TYN612, TYN812, TYN1012
Figure 9.
Figure 11. Surge peak on-state current versus
Figure 13. On-state characteristics (maximum
200
100
10.0
150
140
130
120
110
100
10
1.0
90
80
70
60
50
40
30
20
10
0.1
1
0
0.0
0
1
I
I
dV/dt[R
TM
TSM
(A)
V =0.85V
R =30m
T =105°C
Repetitive
T max.:
t0
d
0.5
(A)
C
TS12
j
T
j
=max
GK
200
Relative variation of dV/dt immunity
versus gate-cathode resistance
(typical values) for TS12 series
number of cycles
values)
1.0
] / dV/dt[
TN12 / TYN12
1.5
400
10
T =25°C
R
j
Non repetitive
T initial=25°C
Number of cycles
GK
j
2.0
=220 ]
R
V
GK
TM
600
2.5
(k )
(V)
3.0
100
800
3.5
4.0
1000
t =10ms
V = 0.67 x V
p
D
One cycle
T
j
= 125°C
4.5
Doc ID 7475 Rev 7
DRM
1000
1200
5.0
Figure 10. Relative variation of dV/dt immunity
Figure 12. Non-repetitive surge peak on-state
Figure 14. Thermal resistance junction to
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
100
2000
1000
80
60
40
20
100
0
10
0
dV/dt[C
0.01
R
0
V = 0.67 x V
th(j-a)
I
D
TSM
R
T
GK
j
= 125°C
= 220
2
(A), I t (A s)
(°C/W)
GK
25
DRM
dI/dt limitation
versus gate-cathode capacitance
(typical values) for TS12 series
current and corresponding values
of I²t versus sinusoidal pulse width
ambient versus copper surface
under tab (DPAK and D
] / dV/dt[
2
4
D PAK
2
2
6
50
0.10
R
GK
DPAK
8
=220 ]
C
t (ms)
S(cm²)
p
GK
75
I
TSM
10
(nF)
TS12
Epoxy printed circuit board FR4
copper thickness = 35 µm
12
I t
2
100
1.00
TN12 / TYN12
14
Characteristics
2
TN12 / TYN12
PAK)
16
125
T initial = 25°C
TS12
j
18
10.00
150
20
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