STM32L151C6 STMicroelectronics, STM32L151C6 Datasheet - Page 108
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STM32L151C6
Manufacturer Part Number
STM32L151C6
Description
Ultra-low-power ARM Cortex-M3 MCU with 32 Kbytes Flash, 32 MHz CPU, LCD, USB
Manufacturer
STMicroelectronics
Datasheet
1.STM32L152VB.pdf
(109 pages)
Specifications of STM32L151C6
Operating Power Supply Range
1.65 V to 3.6 V (without BOR) or 1.8 V to 3.6 V (with BOR option)
Temperature Range
–40 to 85 °C
4 Modes
Sleep, Low-power run (9 μA at 32 kHz), Low-power sleep (4.4 μA),Stop with RTC (1.45 μA), Stop (570 nA), Standby (300 nA)
Ultralow Leakage Per I/o
50 nA
Fast Wakeup From Stop
8 μs
Core
ARM 32-bit Cortex™-M3 CPU
Dma
7-channel DMA controller, supporting timers, ADC, SPIs, I2Cs and USARTs
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Revision history
108/109
Table 66.
17-June-2011
25-Jan-2012
Date
Document revision history (continued)
Revision
5
6
Modified 1st page (low power features)
Added STM32L15xC6 and STM32L15xR6 devices (32 Kbytes of Flash
memory).
Modified
page 18
Modified
Modified
characteristics on page 90
on page 93
Features: updated internal multispeed low power RC.
Table 2: Ultralow power STM32L15xxx device features and peripheral
counts: LCD 4x44 and 8x40 available for both 64- and 128-Kbyte
devices; two comparators available for all devices.
Figure 8: STM32L15xxx UFQFPN48
UFQFPN48 as name of package.
Table 4: STM32L15xxx pin
PC14/PC15.
Table 5: Alternate function
PH2 port, AFIO15 column.
Table 10: Functionalities depending on the operating power supply
range: added footnote 1.
Table 15: Current consumption in Sleep
and f
Table 16: Current consumption in Low power run
temperature conditions; added footnote
Table 17: Current consumption in Low power sleep
some temperature conditions and one of the MSI clock conditions.
Table 18: Typical and maximum current consumptions in Stop
updated I
Table 19: Typical and maximum current consumptions in Standby
mode: updated I
Table 20: Typical and maximum timings in Low power
f
“Wakeup from Stop mode, regulator in Run mode”.
Table 21: Peripheral current
Table 29: PLL
Table 31: Flash memory
Figure 18: I/O AC characteristics
“t
Table 43: I2C
Table 50: ADC
channels, 6-bit sampling rate.
Table 51: ADC
condition.
Table 54: TS
T
HCLK
r(IO)out
S_temp
Doc ID 17659 Rev 6
HCLK
value for t
” by “t
parameter.
Section 3.6: GPIOs (general-purpose inputs/outputs) on
Section 6.3: Operating conditions on page 44
Table 51: ADC accuracy on page
DD
.
(WU from Stop) parameter.
f(IO)out
characteristics: updated typ, min, and max values of the
characteristics: amended footnote
characteristics: updated “PLL output clock”
characteristics: updated f
accuracy: Updated the first, third and fourth f
WUSLEEP_LP
DD
(WU from Standby) parameter.
”.
characteristics: updated all information for I
input/output: removed EVENT OUT from
and
definitions: replaced PH0/PH1 by
; updated typical value of parameter
consumption: replaced GPIOF by GPIOH.
Changes
Table 55: Comparator 1 characteristics
definition: replaced the falling edge
pinout: replaced VFQPN48 by
STM32L151xx, STM32L152xx
mode: updated MSI conditions
2.
S
max value for direct
86,
Table 53: DAC
2.
mode: updated some
mode: updated
modes: updated
ADC
mode:
test
DD
.