STM32F215ZG STMicroelectronics, STM32F215ZG Datasheet
STM32F215ZG
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STM32F215ZG Summary of contents
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... Analog true random number generator ■ CRC calculation unit ■ 96-bit unique ID ■ Analog true random number generator Table 1. Device summary Reference STM32F215RG, STM32F215VG, STM32F215xx STM32F215ZG, STM32F215RE, STM32F215VE, STM32F215ZE STM32F217VG, STM32F217IG, STM32F217xx STM32F217ZG, STM32F217VE, STM32F217IE, STM32F217ZE Doc ID 17050 Rev 6 STM32F215xx STM32F217xx FBGA UFBGA176 (10 × 10 mm) ...
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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F215xx, STM32F217xx 2.2.29 2.2.30 2.2.31 2.2.32 2.2.33 2.2.34 2.2.35 2.2.36 2.2.37 2.2.38 2.2.39 3 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . ...
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Contents 5.3.11 5.3.12 5.3.13 5.3.14 5.3.15 5.3.16 5.3.17 5.3.18 5.3.19 5.3.20 5.3.21 5.3.22 5.3.23 5.3.24 5.3.25 5.3.26 5.3.27 5.3.28 6 Package characteristics . . . . . . . . . . . . . . . . . . ...
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STM32F215xx, STM32F217xx List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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List of tables Table 47. Characteristics of TIMx connected to the APB2 domain . . . . . . . . . . . . . . . . . . . . . . . . . 100 2 ...
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STM32F215xx, STM32F217xx List of figures Figure 1. Compatible board design between STM32F10xx and STM32F2xx for LQFP64 package ...
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List of figures Figure 37. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F215xx, STM32F217xx Figure 86. OTG HS (high speed) device connection, host and dual-role in high-speed mode with external PHY ...
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... Introduction 1 Introduction This datasheet provides the description of the STM32F215xx, and STM32F217xx lines of microcontrollers. For more details on the whole STMicroelectronics STM32™ family, please refer to Section 2.1: Full compatibility throughout the The STM32F215xx, and STM32F217xx datasheet should be read in conjunction with the STM32F20x/STM32F21x reference manual. They will be referred to as STM32F21x devices throughout the document ...
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STM32F215xx, STM32F217xx 2 Description The STM32F21x family is based on the high-performance ARM core operating at a frequency 120 MHz. The family incorporates high-speed embedded memories (Flash memory Mbyte 128 Kbytes of ...
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Table 2. STM32F215xx and STM32F217xx: features and peripheral counts Peripherals STM32F215Rx Flash memory in Kbytes 512 System SRAM in Kbytes Backup FSMC memory controller No Ethernet General-purpose Timers Advanced-control Basic Random number generator 2 SPI / ( ...
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STM32F215xx, STM32F217xx 2.1 Full compatibility throughout the family The STM32F215xx and STM32F217xx constitute the STM32F21x family whose members are fully pin-to-pin, software and feature compatible, allowing the user to try different memory densities and peripherals for a greater degree of ...
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Description Figure 2. Compatible board design between STM32F10xx and STM32F2xx for LQFP100 package Ω Figure 3. Compatible board design between STM32F10xx and STM32F2xx for LQFP144 package Ω 1. RFU = reserved for future use. 14/168 Doc ID 17050 Rev 6 ...
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STM32F215xx, STM32F217xx Figure 4. Compatible board design between STM32F10xx and STM32F2xx for LQFP176 package Ω 1. RFU = reserved for future use. Doc ID 17050 Rev 6 Description 15/168 ...
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Description 2.2 Device overview Figure 5. STM32F21x block diagram 1. The timers connected to APB2 are clocked from TIMxCLK up to 120 MHz, while the timers connected to APB1 are clocked from TIMxCLK MHz. 16/168 Doc ID ...
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STM32F215xx, STM32F217xx ® 2.2.1 ARM Cortex™-M3 core with embedded Flash and SRAM The ARM Cortex-M3 processor is the latest generation of ARM processors for embedded systems. It was developed to provide a low-cost platform that meets the needs of MCU ...
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Description 2.2.5 CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used to ...
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STM32F215xx, STM32F217xx 2.2.8 DMA controller (DMA) The devices feature two general-purpose dual-port DMAs (DMA1 and DMA2) with 8 streams each. They are able to manage memory-to-memory, peripheral-to-memory and memory-to-peripheral transfers. They share some centralized FIFOs for APB/AHB peripherals, support burst ...
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Description 2.2.10 Nested vectored interrupt controller (NVIC) The STM32F215xx and STM32F217xx embed a nested vectored interrupt controller able to manage 16 priority levels, and handle maskable interrupt channels plus the 16 interrupt lines of the Cortex™-M3. The ...
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STM32F215xx, STM32F217xx 2.2.13 Boot modes At startup, boot pins are used to select one out of three boot options: ● Boot from user Flash ● Boot from system memory ● Boot from embedded SRAM The boot loader is located in ...
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Description Regulator ON The regulator ON modes are activated by default on LQFP packages. On UFBGA176 package, they are activated by connecting REGOFF minimum value is 1 There are three regulator ON modes: ● MR ...
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STM32F215xx, STM32F217xx Figure 8. Startup in regulator OFF: fast V - power-down reset risen before V 2.2.17 Real-time clock (RTC), backup SRAM and backup registers The backup domain of the STM32F21x devices includes: ● The real-time clock (RTC) ● 4 ...
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Description 2.2.18 Low-power modes The STM32F21x family supports three low-power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: ● Sleep mode In Sleep mode, only the CPU is stopped. All peripherals ...
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STM32F215xx, STM32F217xx 2.2.20 Timers and watchdogs The STM32F215xx and STM32F217xx devices include two advanced-control timers, eight general-purpose timers, two basic timers and two watchdog timers. All timer counters can be frozen in debug mode. Table 3 compares the features of ...
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Description If configured as standard 16-bit timers, they have the same features as the general-purpose TIMx timers. If configured as 16-bit PWM generators, they have full modulation capability (0- 100%). The TIM1 and TIM8 counters can be frozen in debug ...
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STM32F215xx, STM32F217xx main clock, it can operate in Stop and Standby modes. It can be used either as a watchdog to reset the device when a problem occurs free-running timer for application timeout management hardware- ...
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Description Table 4. USART feature comparison USART Standard Modem LIN name features (RTS/CTS) USART1 X X USART2 X X USART3 X X UART4 X - UART5 X - USART6 X X 2.2.23 Serial peripheral interface (SPI) The STM32F21x feature up ...
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STM32F215xx, STM32F217xx 2.2.25 SDIO An SD/SDIO/MMC host interface is available, that supports MultiMediaCard System Specification Version 4.2 in three different databus modes: 1-bit (default), 4-bit and 8-bit. The interface allows data transfer MHz in 8-bit mode, ...
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Description 2.2.27 Controller area network (CAN) The two CANs are compliant with the 2.0A and B (active) specifications with a bitrate Mbit/s. They can receive and transmit standard frames with 11-bit identifiers as well as extended frames ...
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STM32F215xx, STM32F217xx suspend/resume. The USB OTG full-speed controller requires a dedicated 48 MHz clock that is generated by a PLL connected to the HSE oscillator. The major features are: ● Combined Rx and Tx FIFO size of 1024× 35 bits ...
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Description 2.2.32 Cryptographic acceleration The STM32F215xx and STM32F217xx devices embed a cryptographic accelerator. This cryptographic accelerator provides a set of hardware acceleration for the advanced cryptographic algorithms usually needed to provide confidentiality, authentication, data integrity and non repudiation when exchanging ...
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STM32F215xx, STM32F217xx 2.2.34 GPIOs (general-purpose inputs/outputs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain, with or without pull-up or pull-down), as input (floating, with or without pull-up or pull-down peripheral alternate ...
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Description 2.2.37 Temperature sensor The temperature sensor has to generate a voltage that varies linearly with temperature. The conversion range is between 1.8 and 3.6 V. The temperature sensor is internally connected to the ADC1_IN16 input channel which is used ...
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STM32F215xx, STM32F217xx 3 Pinouts and pin description Figure 9. STM32F21x LQFP64 pinout ...
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Pinouts and pin description Figure 10. STM32F21x LQFP100 pinout 1. RFU means “reserved for future use”. This pin can be tied to V 36/168 ,V or left unconnected Doc ID 17050 Rev 6 STM32F215xx, STM32F217xx ...
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STM32F215xx, STM32F217xx Figure 11. STM32F21x LQFP144 pinout 1. RFU means “reserved for future use”. This pin can be tied left unconnected Doc ID 17050 Rev 6 Pinouts and pin description 37/168 ...
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Pinouts and pin description Figure 12. STM32F21x LQFP176 pinout 1. RFU means “reserved for future use”. This pin can be tied to V 38/168 ,V or left unconnected Doc ID 17050 Rev 6 STM32F215xx, STM32F217xx ...
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STM32F215xx, STM32F217xx Figure 13. STM32F21x UFBGA176 ballout PE3 PE2 PE1 PE0 B PE4 PE5 PE6 PB9 C VBAT PI7 PI6 PI5 PC13- PI8- D PI9 PI4 TAMP1 TAMP2 PC14- E PF0 PI10 PI11 OSC32_IN ...
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Pinouts and pin description Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name - - - 7 D2 PI8 PC13 ( PC14 -OSC32_IN PC15 ...
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STM32F215xx, STM32F217xx Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name PC0 PC1 PC2 PC3 - 19 30 ...
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Pinouts and pin description Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name REGOFF PA4 ...
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STM32F215xx, STM32F217xx Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name - - PF13 - - PF14 - - PF15 - - 56 ...
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Pinouts and pin description Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name N10 M11 PH6 - - - 84 N12 PH7 - - - 85 M12 PH8 - ...
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STM32F215xx, STM32F217xx Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name - P15 PD8 - P14 PD9 - N15 PD10 - N14 PD11 - 59 81 ...
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Pinouts and pin description Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name 116 G15 PC7 117 G14 PC8 118 F14 PC9 41 67 100 119 F15 PA8 42 ...
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STM32F215xx, STM32F217xx Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name - - - 132 D14 - - - 133 C14 - - - 134 C13 - - - 135 D9 V SS_15 - - - 136 C9 ...
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Pinouts and pin description Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name - 87 122 150 B11 PD6 - 88 123 151 A11 PD7 - - 124 152 C10 PG9 - - 125 153 B10 PG10 - ...
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STM32F215xx, STM32F217xx Table 5. STM32F21x pin and ball definitions (continued) Pins Pin name 58 92 136 164 B6 PB6 59 93 137 165 B5 PB7 60 94 138 166 D6 BOOT0 61 95 139 167 A5 PB8 62 96 140 ...
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... Main function after the first backup domain power-up. Later on, it depends on the contents of the RTC registers even after reset (because these registers are not reset by the main reset). For details on how to manage these I/Os, refer to the RTC register description sections in the STM32F20x and STM32F21x reference manual, available from the STMicroelectronics website: www.st.com. ...
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Table 6. Alternate function mapping AF0 AF1 AF2 AF3 Port SYS TIM1/2 TIM3/4/5 TIM8/9/10/11 I2C1/I2C2/I2C3 SPI1/SPI2/I2S2 TIM2_CH1 PA0-WKUP TIM 5_CH1 TIM8_ETR TIM2_ETR PA1 TIM2_CH2 TIM5_CH2 PA2 TIM2_CH3 TIM5_CH3 TIM9_CH1 PA3 TIM2_CH4 TIM5_CH4 TIM9_CH2 PA4 TIM2_CH1 PA5 TIM8_CH1N TIM2_ETR PA6 TIM1_BKIN ...
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Table 6. Alternate function mapping (continued) AF0 AF1 AF2 AF3 Port SYS TIM1/2 TIM3/4/5 TIM8/9/10/11 I2C1/I2C2/I2C3 SPI1/SPI2/I2S2 PB14 TIM1_CH2N TIM8_CH2N PB15 RTC_50Hz TIM1_CH3N TIM8_CH3N PC0 PC1 PC2 PC3 PC4 PC5 PC6 TIM3_CH1 TIM8_CH1 PC7 TIM3_CH2 TIM8_CH2 PC8 TIM3_CH3 TIM8_CH3 PC9 ...
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Table 6. Alternate function mapping (continued) AF0 AF1 AF2 AF3 Port SYS TIM1/2 TIM3/4/5 TIM8/9/10/11 I2C1/I2C2/I2C3 SPI1/SPI2/I2S2 PD14 TIM4_CH3 PD15 TIM4_CH4 PE0 TIM4_ETR PE1 PE2 TRACECLK PE3 TRACED0 PE4 TRACED1 PE5 TRACED2 TIM9_CH1 PE6 TRACED3 TIM9_CH2 PE7 TIM1_ETR PE8 TIM1_CH1N ...
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Table 6. Alternate function mapping (continued) AF0 AF1 AF2 AF3 Port SYS TIM1/2 TIM3/4/5 TIM8/9/10/11 I2C1/I2C2/I2C3 SPI1/SPI2/I2S2 PF15 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PG8 PG9 PG10 PG11 PG12 PG13 PG14 PG15 PH0 - OSC_IN PH1 - OSC_OUT ...
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Table 6. Alternate function mapping (continued) AF0 AF1 AF2 AF3 Port SYS TIM1/2 TIM3/4/5 TIM8/9/10/11 I2C1/I2C2/I2C3 SPI1/SPI2/I2S2 PH14 TIM8_CH2N PH15 TIM8_CH3N PI0 TIM5_CH4 PI1 PI2 TIM8_CH4 PI3 TIM8_ETR PI4 TIM8_BKIN PI5 TIM8_CH1 PI6 TIM8_CH2 PI7 TIM8_CH3 PI8 PI9 PI10 PI11 ...
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Memory mapping 4 Memory mapping The memory map is shown in 56/168 Figure 14. Doc ID 17050 Rev 6 STM32F215xx, STM32F217xx ...
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STM32F215xx, STM32F217xx Figure 14. Memory map 0xFFFF FFFF 512-Mbyte block 7 Cortex-M3's internal 0xE000 0000 peripherals 0xDFFF FFFF 512-Mbyte block 6 Not used 0xC000 0000 0xBFFF FFFF 512-Mbyte block 5 FSMC registers 0xA000 0000 0x9FFF FFFF 512-Mbyte block 4 FSMC ...
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Electrical characteristics 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...
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STM32F215xx, STM32F217xx 5.1.6 Power supply scheme Figure 17. Power supply scheme 1. Each power supply pair must be decoupled with filtering ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate ...
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Electrical characteristics 5.1.7 Current consumption measurement Figure 18. Current consumption measurement scheme 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 8: Current characteristics, and damage to the device. These are stress ratings only and functional ...
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STM32F215xx, STM32F217xx Table 8. Current characteristics Symbol I Total current into V VDD I Total current out of V VSS Output current sunk by any I/O and control pin I IO Output current source by any I/Os and control pin ...
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Electrical characteristics Table 10. General operating conditions (continued) Symbol Parameter V Internal core voltage to be supplied CAP1 externally in REGOFF mode V CAP2 Power dissipation suffix 105 °C for suffix 7 ...
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STM32F215xx, STM32F217xx Table 11. Limitations depending on the operating power supply range Maximum Operating power ADC supply operation range frequency (f 24 MHz with Conversion time up to 2.7 V memory wait 2 Msps 30 ...
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Electrical characteristics Figure 19. Number of wait states versus 5.3.2 VCAP1/VCAP2 external capacitor Stabilization for the main regulator is achieved by connecting an external capacitor to the VCAP1/VCAP2 pins. C ...
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STM32F215xx, STM32F217xx 5.3.3 Operating conditions at power-up / power-down (regulator ON) Subject to general operating conditions for T Table 13. Operating conditions at power-up / power-down (regulator ON) Symbol VDD V DD 5.3.4 Operating conditions at power-up ...
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Electrical characteristics 5.3.5 Embedded reset and power control block characteristics The parameters given in temperature and V Table 15. Embedded reset and power control block characteristics Symbol Programmable voltage V PVD detector level selection (2) V PVD hysteresis PVDhyst Power-on/power-down ...
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STM32F215xx, STM32F217xx Table 15. Embedded reset and power control block characteristics (continued) Symbol Brownout level 1 V BOR1 threshold Brownout level 2 V BOR2 threshold Brownout level 3 V BOR3 threshold (2) V BOR hysteresis BORhyst (2)(3) T Reset temporization ...
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Electrical characteristics Typical and maximum current consumption The MCU is placed under the following conditions: ● At startup, all I/O pins are configured as analog inputs by firmware. ● All peripherals are disabled except explicitly mentioned. ● ...
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STM32F215xx, STM32F217xx Table 17. Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator enabled) or RAM Symbol Parameter Supply current Run mode 1. Code and data processing running ...
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Electrical characteristics Figure 21. Typical current consumption vs temperature, Run mode, code with data processing running from RAM, and peripherals ON Figure 22. Typical current consumption vs temperature, Run mode, code with data processing running from RAM, and peripherals OFF ...
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STM32F215xx, STM32F217xx Figure 23. Typical current consumption vs temperature, Run mode, code with data processing running from Flash, ART accelerator OFF, peripherals ON Figure 24. Typical current consumption vs temperature, Run mode, code with data processing running from Flash, ART ...
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Electrical characteristics Table 18. Typical and maximum current consumption in Sleep mode Symbol Parameter External clock all peripherals enabled Supply current Sleep mode External clock peripherals disabled 1. Based on characterization, tested in production ...
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STM32F215xx, STM32F217xx Figure 25. Typical current consumption vs temperature in Sleep mode, peripherals ON Figure 26. Typical current consumption vs temperature in Sleep mode, peripherals OFF Doc ID 17050 Rev 6 Electrical characteristics 73/168 ...
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Electrical characteristics Table 19. Typical and maximum current consumptions in Stop mode Symbol Parameter Flash in Stop mode, low-speed and high-speed internal RC oscillators and high-speed oscillator Supply current OFF (no independent watchdog) in Stop mode with main Flash in ...
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STM32F215xx, STM32F217xx Table 20. Typical and maximum current consumptions in Standby mode Symbol Parameter Backup SRAM ON, RTC ON Supply current Backup SRAM OFF, RTC Standby DD_STBY Backup SRAM ON, RTC OFF mode Backup SRAM OFF, RTC ...
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Electrical characteristics Table 22. Peripheral current consumption Peripheral AHB1 AHB2 AHB3 AHB2 76/168 (1) Typical consumption at 25 °C GPIO A GPIO B GPIO C GPIO D GPIO E GPIO F GPIO G GPIO H GPIO I OTG_HS + ULPI ...
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STM32F215xx, STM32F217xx Table 22. Peripheral current consumption (continued) Peripheral APB1 (1) Typical consumption at 25 °C TIM2 TIM3 TIM4 TIM5 TIM6 TIM7 TIM12 TIM13 TIM14 USART2 USART3 UART4 UART5 I2C1 I2C2 I2C3 SPI2 SPI3 CAN1 CAN2 (2) DAC channel 1 ...
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Electrical characteristics Table 22. Peripheral current consumption (continued) Peripheral APB2 1. External clock is 25 MHz (HSE oscillator with 25 MHz crystal) and PLL is on. 2. EN1 bit is set in DAC_CR register. 3. EN2 bit is set in ...
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STM32F215xx, STM32F217xx 5.3.8 External clock source characteristics High-speed external user clock generated from an external source The characteristics given in external clock source, and under ambient temperature and supply voltage conditions summarized in Table Table 24. High-speed external user clock ...
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Electrical characteristics Figure 28. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) External clock source Figure 29. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t r(LSE) External ...
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STM32F215xx, STM32F217xx Table 26. HSE 4-26 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance C versus equivalent serial resistance of the crystal (R i HSE driving current 2 g Oscillator transconductance m (4) ...
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Electrical characteristics Table 27. LSE oscillator characteristics (f Symbol R Feedback resistor F Recommended load capacitance (2) C versus equivalent serial resistance of the crystal (R I LSE driving current 2 g Oscillator Transconductance m (4) t startup time SU(LSE) ...
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STM32F215xx, STM32F217xx 5.3.9 Internal clock source characteristics The parameters given in ambient temperature and V High-speed internal (HSI) RC oscillator Table 28. HSI oscillator characteristics Symbol Parameter f Frequency HSI Accuracy of the HSI ACC HSI oscillator HSI oscillator (3) ...
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Electrical characteristics Low-speed internal (LSI) RC oscillator Table 29. LSI oscillator characteristics Symbol (2) f Frequency LSI (3) t LSI oscillator startup time su(LSI) (3) I LSI oscillator power consumption DD(LSI –40 to ...
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STM32F215xx, STM32F217xx Table 30. Main PLL characteristics (continued) Symbol Parameter t PLL lock time LOCK Cycle-to-cycle jitter Period Jitter (3) Jitter Main clock output (MCO) for RMII Ethernet Main clock output (MCO) for MII Ethernet Bit Time CAN jitter (4) ...
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Electrical characteristics Table 31. PLLI2S (audio PLL) characteristics Symbol Parameter Master I2S clock jitter (4) Jitter WS I2S clock jitter PLLI2S power consumption on (5) I DD(PLLI2S PLLI2S power consumption on (5) I DDA(PLLI2S) V DDA 1. TBD ...
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STM32F215xx, STM32F217xx 5.3.11 PLL spread spectrum clock generation (SSCG) characteristics The spread spectrum clock generation (SSCG) feature allows to reduce electromagnetic interferences (see Table 32. SSCG parameters constraint Symbol f Mod md MODEPER * INCSTEP 1. Guaranteed by design, not ...
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Electrical characteristics Figure 34 and Figure 35 down spread modes, where PLL_OUT T is the modulation period. mode md is the modulation depth. Figure 34. PLL output clock waveforms in center spread mode Figure 35. PLL output ...
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STM32F215xx, STM32F217xx Table 34. Flash memory programming Symbol t Word programming time prog t Sector (16 KB) erase time ERASE16KB t Sector (64 KB) erase time ERASE64KB t Sector (128 KB) erase time ERASE128KB t Mass erase time ME V ...
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Electrical characteristics Table 35. Flash memory programming with V Symbol t Double word programming prog t Sector (16 KB) erase time ERASE16KB t Sector (64 KB) erase time ERASE64KB t Sector (128 KB) erase time ERASE128KB t Mass erase time ...
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STM32F215xx, STM32F217xx A device reset allows normal operations to be resumed. The test results are given in defined in application note AN1709. Table 37. EMS characteristics Symbol Voltage limits to be applied on any I/O pin to V FESD induce ...
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Electrical characteristics Table 38. EMI characteristics Symbol Parameter package, conforming to SAE J1752/3 EEMBC, code running with ART enabled S Peak level EMI = 3 package, conforming to SAE J1752/3 ...
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STM32F215xx, STM32F217xx Table 40. Electrical sensitivities Symbol Parameter LU Static latch-up class 5.3.15 I/O current injection characteristics As a general rule, current injection to the I/O pins, due to external voltage below V above V (for standard, 3 V-capable I/O ...
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Electrical characteristics 5.3.16 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 42. I/O static characteristics Symbol Parameter V Input low level voltage IL (2) TT I/O input ...
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STM32F215xx, STM32F217xx All I/Os are CMOS and TTL compliant (no software configuration required). Their characteristics cover more than the strict CMOS-technology or TTL parameters. Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, ...
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Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 44, respectively. Unless otherwise specified, the parameters given in performed under the ambient temperature and V in Table 10. Table 44. I/O AC ...
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STM32F215xx, STM32F217xx Table 44. I/O AC characteristics OSPEEDRy [1:0] bit Symbol (1) value F Maximum frequency max(IO)out 11 Output high to low level fall t f(IO)out time Output low to high level rise t r(IO)out time Pulse width of external ...
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Electrical characteristics 5.3.17 NRST pin characteristics The NRST pin input driver uses CMOS technology connected to a permanent pull-up resistor, R (see PU Unless otherwise specified, the parameters given in performed under the ambient temperature and V in ...
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STM32F215xx, STM32F217xx 5.3.18 TIM timer characteristics The parameters given in Refer to Section 5.3.16: I/O port characteristics function characteristics (output compare, input capture, external clock, PWM output). Table 46. Characteristics of TIMx connected to the APB1 domain Symbol t Timer ...
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Electrical characteristics Table 47. Characteristics of TIMx connected to the APB2 domain Symbol t Timer resolution time res(TIM) Timer external clock f EXT frequency on CH1 to CH4 Res Timer resolution TIM 16-bit counter clock period t when internal clock ...
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STM32F215xx, STM32F217xx 2 Table 48 characteristics Symbol t SCL clock low time w(SCLL) t SCL clock high time w(SCLH) t SDA setup time su(SDA) t SDA data hold time h(SDA) t r(SDA) SDA and SCL rise time t ...
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Electrical characteristics 2 Figure 38 bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V Table 49. SCL frequency ( External pull-up resistance For speeds around 200 ...
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STM32F215xx, STM32F217xx SPI interface characteristics Unless otherwise specified, the parameters given in are derived from tests performed under the ambient temperature, f supply voltage conditions summarized in Refer to Section 5.3.16: I/O port characteristics function characteristics ...
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Electrical characteristics Figure 39. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...
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STM32F215xx, STM32F217xx Figure 41. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: 0.3V (1) ...
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Electrical characteristics 2 Table 51 characteristics Symbol clock frequency 1/t c(CK r(CK clock rise and fall time t f(CK) ( valid time v(WS) ( hold ...
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STM32F215xx, STM32F217xx 2 Figure 42 slave timing diagram (Philips protocol) CPOL = 0 CPOL = 1 WS input SD transmit SD receive 1. Measurement points are done at CMOS levels: 0.3 × LSB transmit/receive of the ...
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Electrical characteristics USB OTG FS characteristics The USB OTG interface is USB-IF certified (Full-Spee the USB OTG HS and USB OTG FS controllers. Table 52. USB OTG FS startup time Symbol (1) t STARTUP 1. Guaranteed by design, not tested ...
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STM32F215xx, STM32F217xx Figure 44. USB OTG FS timings: definition of data signal rise and fall time Differen tial data lines V CRS Table 54. USB OTG FS electrical characteristics Symbol t Rise time r t Fall time ...
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Electrical characteristics Figure 45. ULPI timing diagram Table 57. ULPI timing Control in (ULPI_DIR) setup time Control in (ULPI_NXT) setup time Control in (ULPI_DIR, ULPI_NXT) hold time Data in setup time Data in hold time Control out (ULPI_STP) setup time ...
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STM32F215xx, STM32F217xx Figure 46. Ethernet SMI timing diagram ETH_MDC ETH_MDIO(O) ETH_MDIO(I) Table 59. Dynamics characteristics: Ethernet MAC signals for SMI Symbol t MDC cycle time (2.38 MHz, AHB = 60 MHz) MDC t MDIO write data valid time d(MDIO) t ...
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Electrical characteristics Table 61 gives the list of Ethernet MAC signals for MII and corresponding timing diagram. Figure 48. Ethernet MII timing diagram MII_RX_CLK MII_RXD[3:0] MII_RX_DV MII_RX_ER MII_TX_CLK MII_TX_EN MII_TXD[3:0] Table 61. Dynamics characteristics: Ethernet MAC signals for MII Symbol ...
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STM32F215xx, STM32F217xx 5.3.20 12-bit ADC characteristics Unless otherwise specified, the parameters given in performed under the ambient temperature, f conditions summarized in Table 62. ADC characteristics Symbol Parameter V Power supply DDA V Positive reference voltage REF+ f ADC clock ...
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Electrical characteristics Table 62. ADC characteristics Symbol Parameter Sampling rate ( MHz) ADC ADC V DC current (3) REF I VREF+ consumption in conversion mode ADC VDDA DC current (3) I DDA consumption in conversion ...
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STM32F215xx, STM32F217xx a Table 63. ADC accuracy Symbol ET Total unadjusted error EO Offset error EG Gain error ED Differential linearity error EL Integral linearity error 1. Better performance could be achieved in restricted V 2. Based on characterization, not ...
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Electrical characteristics Figure 50. Typical connection diagram using the ADC R AIN (1) V AIN 1. Refer to Table represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the parasitic pad capacitance ...
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STM32F215xx, STM32F217xx General PCB design guidelines Power supply decoupling should be performed as shown in depending on whether V ceramic (good quality). They should be placed them as close as possible to the chip. Figure 51. Power supply and reference ...
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Electrical characteristics 5.3.21 DAC electrical characteristics Table 64. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Ground SSA (1) R Resistive load with buffer ON LOAD Impedance output with buffer ( ...
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STM32F215xx, STM32F217xx Table 64. DAC characteristics (continued) Symbol Parameter Integral non linearity (difference between measured value at Code i (2) INL and the value at Code line drawn between Code 0 and last Code 1023) Offset error ...
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Electrical characteristics Figure 53. 12-bit buffered /non-buffered DAC Buffered/Non-buffered DAC 1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly without the use of an external operational amplifier. ...
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STM32F215xx, STM32F217xx 5.3.24 Embedded reference voltage The parameters given in temperature and V Table 67. Embedded internal reference voltage Symbol V Internal reference voltage REFINT ADC sampling time when (1) T reading the internal reference S_vrefint voltage Internal reference voltage ...
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Electrical characteristics Figure 54. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms 1. Mode 2/B, C and D only. In Mode 1, FSMC_NADV is not used. Table 68. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to ...
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STM32F215xx, STM32F217xx Figure 55. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms FSMC_NEx FSMC_NOE FSMC_NWE FSMC_A[25:0] FSMC_NBL[1:0] FSMC_D[15:0] FSMC_NADV 1. Mode 2/B, C and D only. In Mode 1, FSMC_NADV is not used. Table 69. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings Symbol t FSMC_NE ...
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Electrical characteristics Figure 56. Asynchronous multiplexed PSRAM/NOR read waveforms FSMC_NE FSMC_NOE FSMC_NWE FSMC_A[25:16] FSMC_NBL[1:0] FSMC_ AD[15:0] FSMC_NADV Table 70. Asynchronous multiplexed PSRAM/NOR read timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to FSMC_NOE low v(NOE_NE) t FSMC_NOE low ...
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STM32F215xx, STM32F217xx Figure 57. Asynchronous multiplexed PSRAM/NOR write waveforms FSMC_NEx FSMC_NOE FSMC_NWE FSMC_A[25:16] FSMC_NBL[1:0] FSMC_ AD[15:0] FSMC_NADV Table 71. Asynchronous multiplexed PSRAM/NOR write timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to FSMC_NWE low v(NWE_NE) t FSMC_NWE low ...
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Electrical characteristics Synchronous waveforms and timings Figure 58 through Table 75 provide the corresponding timings. The results shown in these tables are obtained with the following FSMC configuration: ● BurstAccessMode = FSMC_BurstAccessMode_Enable; ● MemoryType = FSMC_MemoryType_CRAM; ● WriteBurst = FSMC_WriteBurst_Enable; ...
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STM32F215xx, STM32F217xx Table 72. Synchronous multiplexed NOR/PSRAM read timings Symbol t FSMC_CLK period w(CLK) t FSMC_CLK low to FSMC_NEx low (x=0..2) d(CLKL-NExL) t FSMC_CLK low to FSMC_NEx high (x= 0…2) d(CLKL-NExH) t FSMC_CLK low to FSMC_NADV low d(CLKL-NADVL) t FSMC_CLK ...
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Electrical characteristics Figure 59. Synchronous multiplexed PSRAM write timings Table 73. Synchronous multiplexed PSRAM write timings Symbol t w(CLK) t d(CLKL-NExL) t d(CLKL-NExH) t d(CLKL-NADVL) t d(CLKL-NADVH) t d(CLKL-AV) t d(CLKL-AIV) t d(CLKL-NWEL) t d(CLKL-NWEH) t d(CLKL-ADIV d(CLKL-DATA ...
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STM32F215xx, STM32F217xx Figure 60. Synchronous non-multiplexed NOR/PSRAM read timings Table 74. Synchronous non-multiplexed NOR/PSRAM read timings Symbol t FSMC_CLK period w(CLK) t FSMC_CLK low to FSMC_NEx low (x=0..2) d(CLKL-NExL) t FSMC_CLK low to FSMC_NEx high (x= 0…2) d(CLKL-NExH) t FSMC_CLK ...
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Electrical characteristics Figure 61. Synchronous non-multiplexed PSRAM write timings Table 75. Synchronous non-multiplexed PSRAM write timings Symbol t FSMC_CLK period w(CLK) t FSMC_CLK low to FSMC_NEx low (x=0..2) d(CLKL-NExL) t FSMC_CLK low to FSMC_NEx high (x= 0…2) d(CLKL-NExH) t FSMC_CLK ...
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STM32F215xx, STM32F217xx PC Card/CompactFlash controller waveforms and timings Figure 62 through Table 77 provides the corresponding timings. The results shown in this table are obtained with the following FSMC configuration: ● COM.FSMC_SetupTime = 0x04; ● COM.FSMC_WaitSetupTime = 0x07; ● COM.FSMC_HoldSetupTime ...
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Electrical characteristics Figure 63. PC Card/CompactFlash controller waveforms for common memory write access FSMC_NCE4_1 FSMC_NCE4_2 FSMC_A[10:0] FSMC_NREG FSMC_NIOWR FSMC_NIORD t d(NCE4_1-NWE) FSMC_NWE FSMC_NOE FSMC_D[15:0] 132/168 High t v(NCE4_1-A) t d(NREG-NCE4_1) t d(NIORD-NCE4_1) t w(NWE) MEMxHIZ =1 t v(NWE-D) Doc ID ...
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STM32F215xx, STM32F217xx Figure 64. PC Card/CompactFlash controller waveforms for attribute memory read access FSMC_NCE4_1 FSMC_NCE4_2 FSMC_A[10:0] FSMC_NIOWR FSMC_NIORD FSMC_NREG FSMC_NWE t d(NCE4_1-NOE) FSMC_NOE (1) FSMC_D[15:0] 1. Only data bits 0...7 are read (bits 8...15 are disregarded). t v(NCE4_1-A) High t ...
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Electrical characteristics Figure 65. PC Card/CompactFlash controller waveforms for attribute memory write access FSMC_NCE4_1 FSMC_NCE4_2 FSMC_A[10:0] FSMC_NIOWR FSMC_NIORD FSMC_NREG t d(NCE4_1-NWE) FSMC_NWE FSMC_NOE FSMC_D[7:0](1) 1. Only data bits 0...7 are driven (bits 8...15 remains Hi-Z). Figure 66. PC Card/CompactFlash controller ...
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STM32F215xx, STM32F217xx Figure 67. PC Card/CompactFlash controller waveforms for I/O space write access Table 76. Switching characteristics for PC Card/CF read and write cycles in attribute/common space Symbol t FSMC_Ncex low to FSMC_Ay valid v(NCEx-A) t FSMC_NCEx high to FSMC_Ax ...
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Electrical characteristics Table 77. Switching characteristics for PC Card/CF read and write cycles in I/O space Symbol t FSMC_NIOWR low width w(NIOWR) t FSMC_NIOWR low to FSMC_D[15:0] valid v(NIOWR-D) t FSMC_NIOWR high to FSMC_D[15:0] invalid h(NIOWR-D) t FSMC_NCE4_1 low to ...
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STM32F215xx, STM32F217xx Figure 68. NAND controller waveforms for read access Figure 69. NAND controller waveforms for write access Doc ID 17050 Rev 6 Electrical characteristics 137/168 ...
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Electrical characteristics Figure 70. NAND controller waveforms for common memory read access Figure 71. NAND controller waveforms for common memory write access Table 78. Switching characteristics for NAND Flash read cycles Symbol t FSMC_NOE low width w(N0E) FSMC_D[15-0] valid data ...
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STM32F215xx, STM32F217xx Table 79. Switching characteristics for NAND Flash write cycles Symbol t FSMC_NWE low width w(NWE) t FSMC_NWE low to FSMC_D[15-0] valid v(NWE-D) t FSMC_NWE high to FSMC_D[15-0] invalid h(NWE-D) t FSMC_D[15-0] valid before FSMC_NWE high d(D-NWE) t FSMC_ALE ...
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Electrical characteristics Figure 73. SD default mode Table 81 MMC characteristics Symbol Clock frequency in data transfer f PP mode - SDIO_CK/f t Clock low time, f W(CKL) t Clock high time, f W(CKH) t Clock rise time ...
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STM32F215xx, STM32F217xx 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...
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Package characteristics Figure 74. LQFP64 – pin low-profile quad flat package outline Drawing is not to scale. 2. Dimensions are in millimeters. Table 83. LQFP64 – ...
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STM32F215xx, STM32F217xx Figure 76. LQFP100 100-pin low-profile quad flat package outline 100 Pin identification e 1. Drawing is not to scale. 2. Dimensions are in millimeters. ...
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Package characteristics Figure 78. LQFP144 mm, 144-pin low-profile quad flat package outline Seating plane ccc 108 109 144 Pin 1 1 identification 1. Drawing is not to scale. ...
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STM32F215xx, STM32F217xx Figure 80. LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm, package outline C Seating plane Pin 1 identification 1. Drawing is not to scale. Table 86. LQFP176 - Low profile quad flat package ...
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Package characteristics Table 86. LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm package mechanical data k 0° ccc 1. Values in inches are converted from mm and rounded to 4 decimal digits dimension ...
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STM32F215xx, STM32F217xx Figure 81. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline Seating plane Drawing is not to scale. Table 87. UFBGA176+25 - ultra thin ...
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Package characteristics Table 87. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data ddd eee fff 1. Values in inches are converted from mm and rounded to 4 decimal digits. 148/168 0.080 ...
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STM32F215xx, STM32F217xx 6.2 Thermal characteristics The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in °C, ● Θ is the package junction-to-ambient thermal resistance, in °C/W, ● JA ● P max ...
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Part numbering 7 Part numbering Table 89. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = general-purpose Device subfamily 215 = STM32F21x, connectivity, USB OTG FS/HS, cryptographic acceleration 217= STM32F21x, connectivity, USB OTG FS/HS, ...
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STM32F215xx, STM32F217xx Appendix A Application block diagrams A.1 Main applications versus package Table 90 gives examples of configurations for each package. Table 90. Main applications versus package for STM32F2xxx microcontrollers (2) 64 pins Config Config 1 2 OTG USB - ...
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Application block diagrams A.2 Application example with regulator OFF Figure 82. Regulator OFF/internal reset ON 1. This mode is available only on UFBGA176. A.3 USB OTG full speed (FS) interface solutions Figure 83. USB OTG FS (full speed) device-only connection ...
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STM32F215xx, STM32F217xx Figure 84. USB OTG FS (full speed) host-only connection 1. The current limiter is required only if the application has to support a V switch can be used are available on the application board. 2. ...
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Application block diagrams A.4 USB OTG high speed (HS) interface solutions Figure 86. OTG HS (high speed) device connection, host and dual-role in high-speed mode with external PHY possible to use MCO1 or MCO2 to save a ...
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STM32F215xx, STM32F217xx A.5 Complete audio player solutions Two solutions are offered, illustrated in Figure 87 shows storage media to audio DAC/amplifier streaming using a software Codec. This solution implements an audio crystal to provide audio class I clock (0.5% error ...
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Application block diagrams Figure 89. Audio player solution using PLL, PLLI2S, USB and 1 crystal Figure 90. Audio PLL (PLLI2S) providing accurate I2S clock 1 MHz CLKIN /M M=1,2,3,..,64 N=192,194,..,432 156/168 PLLI2S 192 to 432 MHz PhaseC VCO /N /R ...
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STM32F215xx, STM32F217xx Figure 91. Master clock (MCK) used to drive the external audio DAC I2S_CK /I2SD 2,3,4,..,129 1. I2S_SCK is the I2S serial clock to the external audio DAC (not to be confused with I2S_CK). Figure 92. Master clock (MCK) ...
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Application block diagrams A.6 Ethernet interface solutions Figure 93. MII mode using a 25 MHz crystal 1. f must be greater than 25 MHz. HCLK 2. Pulse per second when using IEEE1588 PTP optional signal. Figure 94. RMII with a ...
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STM32F215xx, STM32F217xx Figure 95. RMII with a 25 MHz crystal and PHY with PLL 1. f must be greater than 25 MHz. HCLK 2. The 25 MHz (PHY_CLK) must be derived directly from the HSE oscillator, before the PLL block. ...
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Revision history 8 Revision history Table 91. Document revision history Date Revision 02-Feb-2010 13-Jul-2010 160/168 1 Initial release. Updated datasheet status to PRELIMINARY DATA. Renamed high-speed SRAM, system SRAM. Added UFBGA176 package, and note 1 related to LQFP176 package in ...
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STM32F215xx, STM32F217xx Table 91. Document revision history (continued) Date Revision 25-Nov-2010 Added WLCSP66 (64+2) package. Added note 1 related to LQFP176 on cover page. Update I/Os in Section : Features. Updated Table 6: Multi-AHB Added case of BOR inactivation using ...
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Revision history Table 91. Document revision history (continued) Date Revision 22-Apr-2011 162/168 Changed datasheet status to “Full Datasheet”. APB1 frequency changed form 36 MHz to 30 MHz. Introduced concept of SRAM1 and SRAM2. LQFP176 now in production. Removed WLCSP64+2 package. ...
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STM32F215xx, STM32F217xx Table 91. Document revision history (continued) Date Revision 22-Apr-2011 (continued) Updated Typical and maximum current consumption well as Table 16: Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator ...
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Revision history Table 91. Document revision history (continued) Date Revision 22-Apr-2011 (continued) 164/168 Updated t in Table 46: Characteristics of TIMx connected to the res(TIM) APB1 domain. Modified t res(TIM) TIMx connected to the APB2 Changed w(SCKH) ...
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STM32F215xx, STM32F217xx Table 91. Document revision history (continued) Date Revision 14-Jun-2011 Added SDIO in Table 2: STM32F215xx and STM32F217xx: features and peripheral counts. Updated V for 5V tolerant pins in IN Updated jitter parameters description in characteristics. Remove jitter values ...
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Revision history Table 91. Document revision history (continued) Date Revision 20-Dec-2011 166/168 Updated SDIO register addresses in Updated Figure 3: Compatible board design between STM32F10xx and STM32F2xx for LQFP144 design between STM32F10xx and STM32F2xx for LQFP100 Figure 1: Compatible board ...
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STM32F215xx, STM32F217xx Table 91. Document revision history (continued) Date Revision 20-Dec-2011 (continued) Appendix A.3: USB OTG full speed (FS) interface Figure 84: USB OTG FS (full speed) host-only connection Note 2, updated Figure 85: OTG FS (full speed) connection dual-role ...
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