STTH810 STMicroelectronics, STTH810 Datasheet

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STTH810

Manufacturer Part Number
STTH810
Description
Ultrafast recovery - high voltage diode
Manufacturer
STMicroelectronics
Datasheet

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Main product characteristics
Features and benefits
Description
The high quality design of this diode has
produced a device with low leakage current,
regularly reproducible characteristics and intrinsic
ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term
reliability.
Such demanding applications include industrial
power supplies, motor control, and similar
mission-critical systems that require rectification
and freewheeling. These diodes also fit into
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.
The improved performance in low leakage
current, and therefore thermal runaway guard
band, is an immediate competitive advantage for
this device.
March 2006
Ultrafast, soft recovery
Very low conduction and switching losses
High frequency and/or high pulsed current
operation
High reverse voltage capability
High junction temperature
Insulated packages:
– TO-220Ins
– Electrical insulation = 2500 V
– TO-220FPAC
Capacitance = 7 pF
Electrical insulation = 2500 V
Capacitance = 12 pF
V
t
V
rr
I
F
F(AV)
RRM
(typ)
T
(typ)
j
1000 V
175° C
1.30 V
47 ns
RMS
RMS
8 A
Ultrafast recovery - high voltage diode
Rev 1
Order codes
STTH810G-TR
Part Number
STTH810D
STTH810FP
TO-220AC
STTH810DI
STTH810G
STTH810D
STTH810G
K
NC
D PAK
K
2
A
A
A
K
STTH810
TO-220FPAC
STTH810FP
STTH810DI
STTH810FP
TO-220Ins
STTH810DI
STTH810D
STTH810G
STTH810G
Marking
K
K
www.st.com
A
A
1/11
11

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STTH810 Summary of contents

Page 1

... Ultrafast recovery - high voltage diode 8 A 1000 V 175° TO-220AC STTH810D K RMS STTH810G RMS Order codes Part Number STTH810D STTH810G STTH810G-TR STTH810FP STTH810DI Rev 1 STTH810 TO-220FPAC STTH810FP PAK 2 TO-220Ins STTH810DI Marking STTH810D STTH810G STTH810G STTH810FP STTH810DI 1/11 www.st.com 11 ...

Page 2

... RRM T = 125° 25° 100° 150° (RMS) STTH810 Value 1000 130° 75° 105° 100 60 - 175 175 Value 2 PAK 2.5 5.8 4 ...

Page 3

... STTH810 Table 4. Dynamic characteristics Symbol Parameter t Reverse recovery time rr I Reverse recovery current RM S Softness factor t Forward recovery time fr V Forward recovery voltage FP Figure 1. Conduction losses versus average current P(W) 18 =0.05 =0 (A) F(AV Figure 3. Relative variation of thermal ...

Page 4

... F 50 100 150 200 250 300 350 versus dI /dt (typical values F(AV) T =125° /dt(A/µs) F 100 200 300 STTH810 / =600V R T =125°C j 400 450 500 / F(AV) V =600V R T =125°C j 400 450 ...

Page 5

... STTH810 Figure 11. Forward recovery time versus dI (typical values) t (ns) fr 600 550 500 450 400 350 300 250 dI /dt(A/µs) F 200 0 100 200 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4 µ (°C/W) th(j- ...

Page 6

... Min. Max. Min. A 4.40 4.60 0.173 C 1.23 1.32 0.048 D 2.40 2.72 0.094 E 0.49 0.70 0.019 F 0.61 0.88 0.024 F1 1.14 1.70 0.044 G 4.95 5.15 0.194 H2 10.00 10.40 0.393 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 L5 2.65 2.95 0.104 L6 15.25 15.75 0.600 L7 6.20 6.60 0.244 L9 3.50 3.93 0.137 M 2.6 typ. 0.102 typ. Diam. I 3.75 3.85 0.147 STTH810 Inches Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 0.551 0.116 0.620 0.259 0.154 0.151 ...

Page 7

... STTH810 Table 6. T0-220Ins dimensions Package information DIMENSIONS REF Millimeters Min. Max. Min. A 15.20 15.90 0.598 a1 3.75 a2 13.00 14.00 0.511 B 10.00 10.40 0.393 b1 0.61 0.88 0.024 b2 1.23 1.32 0.048 C 4.40 4.60 0.173 c1 0.49 0.70 0.019 c2 2.40 2.72 0.094 e 4.80 5.40 0.189 F 6.20 6.60 0.244 ØI 3.75 3.85 0.147 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 l2 1.14 1.70 0.044 M 2.60 Inches Max. 0.625 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 ...

Page 8

... Package information Table 7. T0-220FPAC dimensions 8/ Dia STTH810 DIMENSIONS REF Millimeters Inches Min. Max. Min. A 4.4 4.6 0.173 B 2.5 2.7 0.098 D 2.5 2.75 0.098 E 0.45 0.70 0.018 F 0.75 1 0.030 F1 1.15 1.70 0.045 G 4.95 5.20 0.195 G1 2.4 2.7 0.094 H 10 10.4 0.393 L2 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 L4 9.8 10.6 0.386 L5 2.9 3.6 0.114 L6 15.9 16.4 0.626 L7 9.00 9.30 0.354 Dia. ...

Page 9

... STTH810 2 Table 8. D PAK dimensions Figure 14. D PAK footprint (all dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97 ...

Page 10

... Ordering information 3 Ordering information Part Number STTH810D STTH810DI STTH810FP STTH810G STTH810G-TR 4 Revision history Date 02-Mar-2006 10/11 Marking Package STTH810D TO-220AC STTH810DI TO-220Ins STTH810FP TO-220FPAC 2 STTH810G D PAK 2 STTH810G D PAK Revision 1 First issue. STTH810 Weight Base qty Delivery mode 1. Tube 1. Tube 2 Tube 1 ...

Page 11

... STTH810 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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