BAT30F3 STMicroelectronics, BAT30F3 Datasheet - Page 7

• Manufacturer Part Number: BAT30F3
• Description: Schottky Barrier, Signal Schottky
• Manufacturer: STMicroelectronics

BAT30F3
To optimize the natural self centering effect of CSP on the PCB, PCB pad positioning and
size have to be properly designed (see
Micro vias
An alternative to routing on the top surface is to route out on buried layers. To achieve this,
the pads are connected to the lower layers using micro vias. Only SSBU via technology is
approved.
Figure 10. Solder mask opening
255 µm
180 µm
Non solder mask defined
Doc ID 16915 Rev 2
450 µm
370 µm
Figure
100 µm
10)
180 µm
Solder mask defined
PCB recommendations
370 µm
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