STPS140-Y STMicroelectronics, STPS140-Y Datasheet - Page 4

• Manufacturer Part Number: STPS140-Y
• Description: Automotive power Schottky rectifier
• Manufacturer: STMicroelectronics

Characteristics
4/9
Figure 7.
Figure 9.
Figure 11. Forward voltage drop versus
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.0
1E+3
1E+2
1E+0
1E+0
0.2
0.1
1E+1
1E+1
1E-2
1E-2
1E-1
1E-1
1E-2
Z
0.0
Epoxy printed circuit board, copper thickness: 35 µm
I (µA)
0
I
th(j-c)
δ = 0.5
Single pulse
δ = 0.2
δ = 0.1
R
FM
T =125°C
(A)
j
0.1
/R
5
th(j-c)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Reverse leakage current versus
reverse voltage applied
(typical values)
forward current (maximum values)
reccomended pad layout
0.2
1E-1
10
0.3
15
0.4
V
FM
t (s)
1E+0
V (V)
p
T =125°C
T =25°C
T =75°C
j
j
j
R
(V)
0.5
20
0.6
25
0.7
1E+1
δ
30
=tp/T
0.8
Doc ID 17973 Rev 1
T
35
0.9
tp
1E+2
1.0
40
Figure 8.
Figure 10. Junction capacitance versus
Figure 12. Thermal resistance junction to
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
200
100
140
120
100
50
20
10
80
60
40
20
0
1E-2
1
C(pF)
0
Z
R
Epoxy printed circuit board, copper thickness: 35 µm
th(j-c)
δ = 0.5
Single pulse
th(j-a)
δ = 0.2
δ = 0.1
/R
(°C/W)
th(j-c)
Epoxy printed circuit board FR4, copper thickness: 35 µm
1E-1
2
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
reccomended pad layout
reverse voltage applied
(typical values)
ambient versus copper surface
under each lead (SMA)
1
1E+0
reccomended pad layout
S(Cu)(cm²)
2
5
V (V)
t (s)
p
R
1E+1
10
3
δ
20
=tp/T
1E+2
STPS140-Y
4
T
F=1MHz
T =25°C
j
P=1.5W
tp
1E+3
50
5