TSV324 STMicroelectronics, TSV324 Datasheet - Page 9

• Manufacturer Part Number: TSV324
• Description: General purpose low voltage rail to rail input/output op-amp
• Manufacturer: STMicroelectronics

Specifications of TSV324

• High Stability: 500pF
• Operating Temperature Range: -40˚C, +125˚C

TSV321-TSV358-TSV324
3
3.1
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
SOT23-5 package information
Figure 19. SOT23-5 package mechanical drawing
Table 5.
Ref.
A1
A2
E1
e1
A
C
D
E
b
e
L
®
packages. These packages have a lead-free second level interconnect. The
SOT23-5 package mechanical data
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Millimeters
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
0.55
Dimensions
110.2
102.3
Min.
35.4
0.00
35.4
13.7
59.0
13.7
3.5
Package information
Typ.
Mils
37.4
74.8
118.1
118.1
Max.
57.1
51.2
19.7
68.8
21.6
5.9
7.8
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