TS274 STMicroelectronics, TS274 Datasheet
TS274
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TS274 Summary of contents
Page 1
... The major advantage versus JFET devices is the very low input currents drift with temperature (see Figure 5 on page 6). For enhanced features of TS274, in particular rail- to-rail capability and low offset voltage, two new Table 1. Enhanced related families Part ...
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... Parameter TS274C/AC TS274I/AI 18 ±18 -0 ±30 ± +70 -40 to +125 -65 to +150 103 100 500 100 800 Value 1 -40 to 125 TS274 Unit °C °C °C/W °C Unit V V °C ...
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... TS274 2 Block diagram and circuit schematics Figure 1. Block diagram Current source Block diagram and circuit schematics x I Input Second differential stage Output stage Output V CC 3/14 ...
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... Block diagram and circuit schematics Figure 2. Schematic diagram (for 1/4 TS274) 4/14 TS274 ...
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... -100mV 10kΩ 100pF 40dB 10kΩ 100pF 1kHz 100Ω s Electrical characteristics TS274C/AC TS274I/AI Min Typ Max Min Typ Max 1.1 10 1.1 10 0 6.5 6 100 200 1 1 150 300 8.2 8.4 8.2 8.4 8 ...
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... High level output voltage vs. high level output current T = 25˚C amb V = 100mV 16V 10V CC -50 -40 -30 -20 OUTPUT CURRENT Low level output voltage vs. low level output current b P Low level output voltage vs. low level output current b P TS274 -10 0 (mA) ...
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... TS274 Figure 9. Open loop frequency response and phase shift ° 10k Ω Gain Bandwidth Product - ...
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... Macromodel code ******************************** .SUBCKT TS27X *** INP INP+ =2, OUT = 3 VDD=4 VSS = 5 *** TYPE = TS271/TS272/TS274 .MODEL MDTH D IS=1E-8 KF=2.664E-16 CJO=10F ***INPUT STAGE CIP 2 5 1E-12 CIN 1 5 1E-12 EIP EIN ...
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... TS274 DINR 15 18 MDTH 400E-12 VIP 2.2 ***GM1 STAGE FGM1P 119 5 VOFP 1 FGM1N 119 5 VOFN 1 RAP 119 4 1E6 RAN 119 5 1E6 ***GM2 STAGE G2P 19 5 119 5 4E-4 G2N 19 5 119 4 4E-4 R2P 19 4 450E3 R2N 19 5 450E3 ***COMPENSATION CC 19 119 7p ***BUFFER EBUF ...
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... Figure 15. DIP14 package mechanical drawing Table 5. DIP14 package mechanical data Ref 10/14 www.st.com. Millimeters Min. Typ. Max. 0.51 1.39 1.65 0.5 0.25 20 8.5 2.54 15.24 7.1 5.1 3.3 1.27 2.54 TS274 ® Inches Min. Typ. Max. 0.020 0.055 0.065 0.020 0.010 0.787 0.335 0.100 0.600 0.280 0.201 0.130 0.050 0.100 ...
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... TS274 5.2 SO-14 package information Figure 16. SO-14 package mechanical drawing Table 6. SO-14 package mechanical data Ref Dimensions Millimeters Min. Typ. Max. 1.75 0.1 0.2 1.65 0.35 0.46 0.19 0.25 0.5 8.55 8.75 5.8 6.2 1.27 7.62 3.8 4.0 4.6 5.3 0.5 1.27 0.68 Package information Inches Min. Typ. 0.003 0.013 0.007 0.019 45° (typ.) 0.336 0.228 0.050 0.300 0.149 ...
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... Min. Typ. Max. 1.2 0.05 0.15 0.8 1 1.05 0.19 0.30 0.09 0.20 4.9 5 5.1 6.2 6.4 6.6 4.3 4.4 4.48 0.65 BSC 0° 8° 0.45 0.60 0. Inches Min. Typ. 0.002 0.004 0.031 0.039 0.007 0.004 0.193 0.197 0.244 0.252 0.169 0.173 0.0256 BSC 0° 0.018 0.024 TS274 Max. 0.047 0.006 0.041 0.012 0.0089 0.201 0.260 0.176 8° 0.030 ...
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... ESD protection inserted in Thermal resistance junction to case information added see 2 on page 2. Macromodel insertion in Added information on enhanced related families of devices on cover page. 3 Removed TS274B version in AMR table and in order codes table. Ordering information Packing Marking 274C Tube or Tape & reel 274AC TS274CN ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 14/14 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com TS274 ...