TS982 STMicroelectronics, TS982 Datasheet - Page 15

• Manufacturer Part Number: TS982
• Description: High output current dual operational amplifier
• Manufacturer: STMicroelectronics

TS982
3.3
3.4
Thermal management benefits
A good thermal design is important to maintain the temperature of the silicon junction below
T
power level.
Another effect of temperature is that the life expectancy of an integrated circuit decreases
exponentially when operating at high temperature over an extended period of time. It is
estimated that, the chip failure rate doubles for every 10° to 20° C. This demonstrates that
reducing the junction temperature is also important to improve the reliability of the amplifier.
Because of the high dissipation capability of the SO-8 exposed-pad package, the dual op-
amp TS982 has a lower junction temperature for high current applications in high ambient
temperatures.
Thermal management guidelines
The following guidelines are a simple procedure to determine the PCB you should use in
order to get the best from the SO-8 exposed-pad package:
1.
2.
3.
Therefore, the maximum thermal resistance between junction and ambient R
Different PCBs can give the right R
SO-8 exposed pad versus the copper area of a top side PCB.
j
= 150° C as given in the absolute maximum ratings and also to maintain the operating
Determine the total power P
P
I
Figure 1: Current consumption vs. supply voltage on page 7
V
The other terms are the power dissipated by the two operators to source the load. If the
output signal can be assimilated to a DC signal, you can calculate the dissipated power
using the voltage drop curves versus output current, supply voltage, and temperature
(Figure 2 on page 7
Specify the maximum operating temperature, (T
Specify the maximum junction temperature (T
discussed above, T
considerations.
R
CC
total
CC
thja
x V
and versus temperature.
= (T
= I
CC
CC
j
is the DC power needed by the TS982 to operate with no load. Refer to
- T
x V
a
)/P
CC
total
+ V
j
to
must be below 150°C and as low as possible for reliability
drop1
Figure 8 on page
x I
total
out1
thja
to be dissipated by the IC.
+ V
for a given application.
drop2
x I
8).
out2
j
) at the maximum output power. As
a
) of the TS982.
Figure 42
to determine I
Application information
gives the R
thja
CC
is:
thja
versus
of the
15/20