2013620-2 TE Connectivity, 2013620-2 Datasheet
2013620-2
Manufacturer Part Number
2013620-2
Description
Manufacturer
TE Connectivity
Datasheet
1.1-2013620-2.pdf
(7 pages)
Specifications of 2013620-2
Insertion Force
ZIF
Pcb Mount Style
Surface Mount
Grid Size
35x36
Grid Spacing (mm [in])
1.00 x 1.00 [.039 x .039]
Chip Compatibility
Intel® Core rPGA989
Frame Style
Open
Heat Sink Attachment
Without
Zif Actuator
Screwdriver/Cam
Profile
Low
Cover Material
High Temperature Thermoplastic
Leg Style
Ball Grid Array (BGA)
Socket Identifier
rPGA989
Number Of Positions
989
Assembly Process Feature
Pick and Place Cover, Tape
Cover Color
Black
Contact Style
Stamped + Formed
Contact Base Material
Copper Alloy
Contact Plating, Mating Area, Material
Gold (15)
Housing Color
Black
Housing Material
High Temperature Thermoplastic
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Application
Production
Packaging Method
Tape Mounted on Reel
Packaging Quantity
160
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
2013620-2
Manufacturer:
TYCO
Quantity:
1 080
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