MCP6548-E/MS Microchip Technology, MCP6548-E/MS Datasheet - Page 26

IC COMP 1.6V SGL O-D W/CS 8MSOP

MCP6548-E/MS

Manufacturer Part Number
MCP6548-E/MS
Description
IC COMP 1.6V SGL O-D W/CS 8MSOP
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6548-E/MS

Output Type
CMOS, Open-Drain, Rail-to-Rail, TTL
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number Of Elements
1
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
1 Channel
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Comparator Type
Low Power
No. Of Comparators
1
Ic Output Type
Open Drain
Output Compatibility
CMOS, TTL
Supply Current
0.6µA
Supply Voltage Range
1.6V To 5.5V
Amplifier Case Style
MSOP
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP6548-E/MS
Manufacturer:
Microchip Technology
Quantity:
135
MCP6546/6R/6U/7/8/9
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
DS21714E-page 26
Note:
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold fla sh or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tole rance, for information purposes only.
JEDEC Equivalent: MO-153 AB-1
Drawing No. C04-087
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
See ASME Y14.5M
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
β
n
Dimension Limits
E1
E
Units
A2
E1
A1
p
E
D
L
φ
B
α
n
A
c
β
MIN
.033
.002
.246
.193
.020
.004
.007
.039
.169
2
1
.026 BSC
12° REF
12° REF
INCHES
L
φ
NOM
D
.004
.024
.035
.173
.197
.006
.010
.041
.251
14
A1
MAX
A
.043
.037
.006
.256
.177
.028
.008
.012
.201
MIN
1.00
0.85
0.05
6.25
4.30
4.90
0.50
0.09
0.19
MILLIMETERS*
Revised: 08-17-05
0.65 BSC
© 2006 Microchip Technology Inc.
12° REF
12° REF
NOM
1.05
0.90
0.10
6.38
4.40
5.00
0.60
0.15
0.25
14
A2
MAX
1.10
0.95
0.15
6.50
4.50
5.10
0.70
0.20
0.30
α

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