MINISMDC150F%2F24-2 TE Connectivity

MINISMDC150F%2F24-2

Manufacturer Part Number

MINISMDC150F%2F24-2

Description

Manufacturer

TE Connectivity

Specifications of MINISMDC150F%2F24-2

Ul File Number

E74889

Csa File Number

CA78165

Vmax Operating (v)

Vmax (v)

Imax (a)

Ih (room Temperature) (a)

1.5

It (room Temperature) (a)

3.00

Rmin (?)

0.04

R1 Max [post Trip] (?)

0.12

Power Dissipation (max) (w)

Construction

Surface Mount

Family Name

miniSMD

Form Factor (inches)

1812

Form Factor (mm)

4532

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C, Reflow solder capable to 260°C

Rohs/elv Compliance History

Always was RoHS compliant

Tuv Certificate No.

R72041438

Operating Temperature (max.) (°c)

Application

Surface Mount

Packaging Method

Tape & Reel

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MINISMDC150F%2F24-2MINISMDC150F/24-2

Manufacturer:

TEConnec

Quantity:

1 700

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MINISMDC150F%2F24-2MINISMDC150F/24-2

Manufacturer:

TYCO

Quantity:

2 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

MINISMDC150F%2F24-2MINISMDC150F/24-2

Manufacturer:

LITTELFUSE/力特

Quantity:

20 000

Company:

H&T Electronics

Part Number:

MINISMDC150F%2F24-2MINISMDC150F/24-2

Quantity:

950

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