PMDPB65UP NXP Semiconductors, PMDPB65UP Datasheet - Page 11

Dual small-signal P-channel enhancement mode Field-Effect Transistor (FET) in a small and leadless ultra thin SOT1118 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology

PMDPB65UP

Manufacturer Part Number
PMDPB65UP
Description
Dual small-signal P-channel enhancement mode Field-Effect Transistor (FET) in a small and leadless ultra thin SOT1118 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
9. Soldering
PMDPB65UP
Product data sheet
Fig 18. Reflow soldering footprint for SOT1118 (HUSON6)
2.25
0.875
0.875
0.35
0.45
(6×)
(6×)
0.65
0.49
All information provided in this document is subject to legal disclaimers.
2.1
0.49
0.65
Rev. 2 — 8 March 2011
0.72
0.82
(2×)
(2×)
1.05
(6×)
(2×)
0.3
1.15
(6×)
(2×)
0.4
20 V, 3.5 A dual P-channel Trench MOSFET
Dimensions in mm
PMDPB65UP
solder lands
solder paste
solder resist
occupied area
sot1118_fr
© NXP B.V. 2011. All rights reserved.
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