NX3008PBK NXP Semiconductors, NX3008PBK Datasheet - Page 12
NX3008PBK
Manufacturer Part Number
NX3008PBK
Description
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet
1.NX3008PBK.pdf
(16 pages)
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NXP Semiconductors
10. Soldering
NX3008PBK
Product data sheet
Fig 19. Reflow soldering footprint for SOT23 (TO-236AB)
Fig 20. Wave soldering footprint for SOT23 (TO-236AB)
4.6
3
1.7
2.6
(3×)
0.7
(2×)
1.4
1.4
(2×)
1.2
All information provided in this document is subject to legal disclaimers.
(3×)
(3×)
3.3
2.9
1.9
0.5
0.6
1
2.8
4.5
2.2
Rev. 1 — 1 August 2011
(3×)
0.6
2
preferred transport direction during soldering
30 V, 230 mA P-channel Trench MOSFET
Dimensions in mm
Dimensions in mm
NX3008PBK
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sot023_fr
sot023_fw
© NXP B.V. 2011. All rights reserved.
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