LPC2420_60 NXP Semiconductors, LPC2420_60 Datasheet - Page 49
LPC2420_60
Manufacturer Part Number
LPC2420_60
Description
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer
NXP Semiconductors
Datasheet
1.LPC2420_60.pdf
(86 pages)
- Current page: 49 of 86
- Download datasheet (497Kb)
NXP Semiconductors
9. Thermal characteristics
Table 7.
V
Table 8.
V
LPC2420_60
Product data sheet
Symbol
T
LQFP208
ja
JEDEC (4.5 in 4 in)
0 m/s
1 m/s
2.5 m/s
Single-layer (4.5 in 3 in)
0 m/s
1 m/s
2.5 m/s
jc
jb
DD
DD
j(max)
= 3.0 V to 3.6 V; T
= 3.0 V to 3.6 V; T
Thermal characteristics
Thermal resistance value (C/W): ±15 %
Parameter
maximum junction
temperature
amb
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
=
•
•
•
j
=
T
R
P
40
40
amb
D
T
th(j-a)
27.4
25.7
24.4
35.4
31.2
29.2
8.8
15.4
amb
= sum of internal and I/O power dissipation
C to +85
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
C unless otherwise specified;
C unless otherwise specified;
R
th j a
Rev. 6.1 — 22 September 2011
–
TFBGA208
ja
JEDEC (4.5 in 4 in)
0 m/s
1 m/s
2.5 m/s
8-layer (4.5 in 3 in)
0 m/s
1 m/s
2.5 m/s
jc
jb
j
(C), can be calculated using the following
Min
-
DD
Flashless 16-bit/32-bit microcontroller
and V
DD
Typ
-
LPC2420/2460
. The I/O power dissipation of
41
35
31
34.9
30.9
28
8.3
13.6
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
C
49 of 86
(1)
Related parts for LPC2420_60
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Flashless 16-bit/32-bit Microcontroller; Ethernet, Can, Isp/iap, Usb 2.0 Device/host/otg, External Memory Interface
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: