LPC1112FD20 NXP Semiconductors, LPC1112FD20 Datasheet - Page 3

• Manufacturer Part Number: LPC1112FD20
• Description: The LPC1112FD20 is an ARM Cortex-M0 based, low-cost 32-bit MCU, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/1
• Manufacturer: NXP Semiconductors

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC111X
Product data sheet
Type number
SO20, TSSOP20, TSSOP28, and DIP28 packages
LPC1110FD20
LPC1111FDH20/002
LPC1112FD20/102
LPC1112FDH20/102
LPC1112FDH28/102
LPC1114FDH28/102
LPC1114FN28/102
HVQFN33 and LQFP48 packages
LPC1111FHN33/101
LPC1111FHN33/102
LPC1111FHN33/201
LPC1111FHN33/202
LPC1112FHN33/101
LPC1112FHN33/102
LPC1112FHN33/201
LPC1112FHN33/202
LPC1112FHI33/202
LPC1113FHN33/201
LPC1113FHN33/202
LPC1113FHN33/301
Ordering information (LPC1100 and LPC1100L series)


Package
Name
SO20
TSSOP20
SO20
TSSOP20
TSSOP28
TSSOP28
DIP28
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
eMetering
Alarm systems
Description
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
DIP28: plastic dual in-line package; 28 leads (600 mil)
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 1 March 2012
LPC1110/11/12/13/14/15


Lighting
White goods
32-bit ARM Cortex-M0 microcontroller
© NXP B.V. 2012. All rights reserved.
Version
SOT163-1
SOT360-1
SOT163-1
SOT360-1
SOT361-1
SOT361-1
SOT117-1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
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