IP4309CX9 NXP Semiconductors, IP4309CX9 Datasheet - Page 9

The IP4309CX9 is a 8-channel low capacitance ElectroStatic Discharge (ESD) protection device, providing protection to downstream components from ESD voltages up to ±15 kV contact discharge and higher than ±15 kV air discharge, far exceeding

IP4309CX9

Manufacturer Part Number
IP4309CX9
Description
The IP4309CX9 is a 8-channel low capacitance ElectroStatic Discharge (ESD) protection device, providing protection to downstream components from ESD voltages up to ±15 kV contact discharge and higher than ±15 kV air discharge, far exceeding
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
Table 6.
[1]
[2]
[3]
10. Design and assembly recommendations
IP4309CX9
Product data sheet
Description
Device
Carrier tape antistatic
Cover tape
Bending radius
Cumulated pitch error: 0.2 mm per 10 pitches.
Carbon-loaded polystyrene 100 % recyclable.
The cover tape shall not overlap the sprocket holes.
[3]
Tape dimensions
10.1 PCB design guidelines
10.2 PCB assembly guidelines for Pb-free soldering
[2]
It is recommended, for optimum performance, to use a Non-Solder Mask
Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled
micro-vias connecting the ground pads to a buried ground-plane layer. This results in the
lowest possible ground inductance and provides the best high frequency and
ESD performance. Refer to
Table 7.
Table 8.
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
…continued
rotation
in winding direction
Item
film thickness
width
film thickness
Recommended PCB design parameters
Assembly recommendations
All information provided in this document is subject to legal disclaimers.
HDMI octal channel low capacitive high-performance ESD protection
Rev. 1 — 10 March 2011
Table 7
Symbol
T
W
T
R
1
1
for the recommended PCB design parameters.
Value or specification
250 m
100 m (0.004 inch)
325 m
20 m to 40 m
AuNi
FR4
Value or specification
325 m
100 m (0.004 inch)
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
50 : 50
see
Figure 9
Specification (mm)
Dimension
20
0.25
5.75
0.1
30
IP4309CX9
Tolerance
max
0.07
max
max
min
© NXP B.V. 2011. All rights reserved.
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