IP4284CZ10-TBR_TT NXP Semiconductors, IP4284CZ10-TBR_TT Datasheet - Page 11

• Manufacturer Part Number: IP4284CZ10-TBR_TT
• Description: The devices are designed to protect high-speed interfaces such as High-DefinitionMultimedia Interface (HDMI), DisplayPort, SuperSpeed USB, external Serial AdvancedTechnology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfacesa
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Soldering
IP4284CZ10-TBR_TT
Product data sheet
Fig 14. Reflow soldering footprint SOT1176-1 (XSON10)
Footprint information for reflow soldering of XSON10 package
Dimensions in mm
0.5
P
Reflow soldering is the only recommended soldering method.
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
1.25
Ay
0.3
By
Hy
Ay
0.475
C
By
0.2
D
D
2.45
Hx
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
1.5
Hy
Rev. 3 — 19 May 2011
Generic footprint pattern
Remark:
Stencil of 75
A stencil of 75
With a stencil of 100
Hx
μ
m is recommended.
μ
ESD protection for ultra high-speed interfaces
m gives an aspect ratio of 0.77
P
μ
m one will obtain an aspect ratio of 0.58
IP4284CZ10-TBR/TT
0.05
0.05
C
© NXP B.V. 2011. All rights reserved.
sot1176-1_fr
SOT1176-1
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