BAV756S_BAW56_SER NXP Semiconductors, BAV756S_BAW56_SER Datasheet
BAV756S_BAW56_SER
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BAV756S_BAW56_SER Summary of contents
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BAV756S; BAW56 series High-speed switching diodes Rev. 05 — 26 November 2007 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number Package BAV756S BAW56 BAW56M BAW56S BAW56T BAW56W ...
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... BAW56; BAW56T; BAW56W BAW56M BAW56S BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series Pinning Description anode (diode 1) cathode (diode 2) common anode (diode 2 and diode 3) cathode (diode 3) anode (diode 4) common cathode (diode 1 and diode 4) cathode (diode 1) cathode (diode 2) ...
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... W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series Ordering information Package Name Description SC-88 plastic surface-mounted package; 6 leads - plastic surface-mounted package; 3 leads SC-101 leadless ultra small plastic package ...
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... Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Reflow soldering is the only recommended soldering method. [4] Single diode loaded. 6. Thermal characteristics Table 7. Symbol Per diode R th(j-a) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series Limiting values …continued Parameter Conditions repetitive peak forward current non-repetitive peak forward square wave current ...
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... [1] Pulse test: t [2] When switched from I [3] When switched from I BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series Thermal characteristics …continued Parameter thermal resistance from junction to solder point BAV756S BAW56 BAW56S BAW56T BAW56W Characteristics Parameter Conditions forward voltage ...
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... T = 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 006aab109 I FSM 1.0 1.4 V (V) F Fig 2. Non-repetitive peak forward current as a 006aab110 60 80 100 ...
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... Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series SAMPLING OSCILLOSCOPE mga881 = 0.6 ns ...
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... Dimensions in mm Fig 7. Package outline BAW56 (SOT23/TO-236AB) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 9. Package outline BAV756S and BAW56S (SOT363/SC-88) Fig 11. Package outline BAW56W (SOT323/SC-70) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 1.1 0.9 0.45 0.15 2 0.48 0.15 0.38 0.09 04-11-04 Dimensions in mm Fig 8. Package outline BAW56M (SOT883/SC-101) 1.1 0.8 0.45 4 0.15 1 ...
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... For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering Fig 12. Reflow soldering footprint BAW56 (SOT23/TO-236AB) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series Packing methods Description SOT363 4 mm pitch tape and reel pitch tape and reel ...
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... NXP Semiconductors 4.60 Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB) Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 3.40 1.20 (2x) 2 4.00 1.20 3 2.80 4. 0.05 ( 0.90 0. solder lands solder paste Reflow soldering is the only recommended soldering method. Rev. 05 — 26 November 2007 ...
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... NXP Semiconductors Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88) Dimensions in mm Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 2.35 solder lands 0.50 solder paste (4 ) solder resist 0.50 occupied area (4 ) Dimensions in mm 5.25 4.50 solder lands 1.15 3.75 solder resist ...
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... NXP Semiconductors Fig 17. Reflow soldering footprint BAW56T (SOT416/SC-75) Fig 18. Reflow soldering footprint BAW56W (SOT323/SC-70) Fig 19. Wave soldering footprint BAW56W (SOT323/SC-70) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 2.0 0.85 0.6 (3x) Dimensions in mm 2.65 0.75 1.325 1. 0.60 2. 2.40 4.60 4.00 1. 3.65 2.10 1 preferred transport direction during soldering Rev. 05 — ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BAV756S_BAW56_SER_5 20071126 • Modifications: • • • • • • • • • • • • • • • • • • BAV756S_2 19971021 BAW56_4 20030325 BAW56S_2 19971021 BAW56T_2 19971219 ...
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... Contact information For additional information, please visit: For sales office addresses, send an email to: BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series [3] Definition This document contains data from the objective specification for product development. ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BAV756S_BAW56_SER_5 All rights reserved. Date of release: 26 November 2007 ...