BAV70_SER NXP Semiconductors, BAV70_SER Datasheet - Page 12

• Manufacturer Part Number: BAV70_SER
• Description: High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
• Manufacturer: NXP Semiconductors

NXP Semiconductors
BAV70_SER_7
Product data sheet
Fig 17. Reflow soldering footprint BAV70T (SOT416/SC-75)
Fig 18. Reflow soldering footprint BAV70W (SOT323/SC-70)
Fig 19. Wave soldering footprint BAV70W (SOT323/SC-70)
3.65
2.35
2.10
0.85
Dimensions in mm
preferred transport direction during soldering
Rev. 07 — 27 November 2007
0.60
(3 )
0.55
(3 )
2.0
0.85
0.75
3
3
4.00
1.15
4.60
2.65
1.30
2.40
2
1
(3x)
0.6
1.325
2
1
0.6
solder lands
solder resist
3
2.2
0.7
1.9
2
1
msa429
1.1
0.50
(3 ) 1.90
0.90
(2 )
msa438
High-speed switching diodes
2.70
(3x)
0.5
solder paste
occupied area
Dimensions in mm
BAV70 series
1.5
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
© NXP B.V. 2007. All rights reserved.
msa419
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