PMEG3005CT NXP Semiconductors, PMEG3005CT Datasheet - Page 10

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier incommon cathode configuration with an integrated guard ring for stress protection,encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plasticpackage

PMEG3005CT

Manufacturer Part Number
PMEG3005CT
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier incommon cathode configuration with an integrated guard ring for stress protection,encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plasticpackage
Manufacturer
NXP Semiconductors
Datasheet

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PMEG3005CT
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NXP Semiconductors
11. Soldering
PMEG3005CT
Product data sheet
[1]
Fig 16. Reflow soldering footprint SOT23 (TO-236AB)
Fig 17. Wave soldering footprint SOT23 (TO-236AB)
4.6
3
For further information and the availability of packing methods, see
1.7
2.6
(3×)
0.7
(2×)
1.4
1.4
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 September 2010
(2×)
1.2
(3×)
(3×)
3.3
2.9
1.9
0.5
0.6
1
2.2
2.8
4.5
500 mA low V
(3×)
0.6
F
dual MEGA Schottky barrier rectifier
2
preferred transport direction during soldering
Section
PMEG3005CT
14.
Dimensions in mm
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sot023_fr
sot023_fw
10 of 14

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