BAS40_1PSXXSB4X_SER NXP Semiconductors, BAS40_1PSXXSB4X_SER Datasheet - Page 12

• Manufacturer Part Number: BAS40_1PSXXSB4X_SER
• Description: General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plasticpackages
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 15. Reflow soldering footprint SOD323 (SC-76)
Fig 16. Wave soldering footprint SOD323 (SC-76)
Fig 17. Reflow soldering footprint SOD523 (SC-79)
Dimensions in mm
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
2.75
0.95
1.20
BAS40 series; 1PSxxSB4x series
Rev. 08 — 13 January 2010
0.50
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
solder paste
3.05
2.80
2.10
1.60
1.20
5.00
4.40
1.40
0.50
msa433
1.80
1.90
0.60
2.15
msa415
General-purpose Schottky diodes
0.30
0.40
0.50
mgs343
solder lands
solder resist
occupied area
0.60
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
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