BYV25FX-600 NXP Semiconductors, BYV25FX-600 Datasheet - Page 4

• Manufacturer Part Number: BYV25FX-600
• Description: Enhanced ultrafast power diode in a SOD113 (2-lead TO-220F) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
5. Thermal characteristics
Table 5.
6. Isolation characteristics
Table 6.
BYV25FX-600
Product data sheet
Symbol
R
R
Symbol
V
C
Fig 4.
isol(RMS)
th(j-h)
th(j-a)
isol
Transient thermal impedance from junction to heatsink as a function of pulse width
Thermal characteristics
Isolation characteristics
Parameter
thermal resistance from
junction to heatsink
thermal resistance from
junction to ambient
Parameter
RMS isolation voltage
isolation capacitance
Z
(K/W)
th(j-h)
10
10
10
10
−1
−2
−3
1
10
Conditions
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all
pins to external heatsink; sinusoidal
waveform; clean and dust free
f = 1 MHz; from cathode to external
heatsink
−6
All information provided in this document is subject to legal disclaimers.
Conditions
with heatsink compound;
see
in free air
10
−5
Figure 4
Rev. 02 — 7 March 2011
10
−4
10
−3
10
−2
P
10
t
p
−1
T
001aaf257
1
δ =
t
p
(s)
T
t
p
t
10
Enhanced ultrafast power diode
Min
-
-
Min
-
-
BYV25FX-600
Typ
-
55
Typ
-
10
© NXP B.V. 2011. All rights reserved.
-
Max
5.5
Max
2500
-
Unit
K/W
K/W
Unit
V
pF
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