TDA1308 NXP Semiconductors, TDA1308 Datasheet - Page 17
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TDA1308
Manufacturer Part Number
TDA1308
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TDA1308.pdf
(17 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA1308
Manufacturer:
NXP
Quantity:
5 510
Part Number:
TDA1308
Manufacturer:
PHI
Quantity:
20 000
Company:
Part Number:
TDA1308/N1
Manufacturer:
PHI
Quantity:
20 000
Part Number:
TDA1308AT
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
TDA1308ATN1
Manufacturer:
PH
Quantity:
5 838
Company:
Part Number:
TDA1308T
Manufacturer:
NXP
Quantity:
30 000
Company:
Part Number:
TDA1308T
Manufacturer:
NXP
Quantity:
45 000
Part Number:
TDA1308T
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
TDA1308T/N1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
TDA1308T/N2
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering of SMD packages . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Introduction to soldering . . . . . . . . . . . . . . . . . 11
Wave and reflow soldering . . . . . . . . . . . . . . . 11
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Class-AB stereo headphone driver
Date of release: 14 March 2011
Document identifier: TDA1308
TDA1308
All rights reserved.