BTA2008W-600D NXP Semiconductors, BTA2008W-600D Datasheet - Page 12

Planar passivated high commutation three quadrant triac in a SOT223 surface mountable plastic package

BTA2008W-600D

Manufacturer Part Number
BTA2008W-600D
Description
Planar passivated high commutation three quadrant triac in a SOT223 surface mountable plastic package
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
8. Soldering
BTA2008W-600D
Product data sheet
Fig 15. Reflow soldering footprint for SOT223 (SOT223)
Fig 16. Wave soldering footprint for SOT223 (SOT223)
1.9
(4×)
1.3
(4×)
1.2
1
1
2.7
2.3
6.15
8.9
6.7
1.1
3.85
(3×)
(3×)
3.6
3.5
1.2
1.3
7
4
2
All information provided in this document is subject to legal disclaimers.
4
2
0.3
2.3
2.7
Rev. 1 — 7 July 2011
3
(2×)
1.9
3
3.9
6.2
6.1
(3×)
1.9
7.65
8.7
BTA2008W-600D
Dimensions in mm
Dimensions in mm
direction during soldering
preferred transport
solder lands
solder resist
occupied area
solder lands
solder resist
solder paste
occupied area
sot223_fr
sot223_fw
© NXP B.V. 2011. All rights reserved.
3Q Hi-Com Triac
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