MCP6544-E/SL Microchip Technology, MCP6544-E/SL Datasheet - Page 25
![IC COMP 1.6V QUAD P-P 14SOIC](/photos/6/59/65933/150-14-soic_sml.jpg)
MCP6544-E/SL
Manufacturer Part Number
MCP6544-E/SL
Description
IC COMP 1.6V QUAD P-P 14SOIC
Manufacturer
Microchip Technology
Type
General Purposer
Specifications of MCP6544-E/SL
Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
14-SOIC (0.154", 3.90mm Width)
Number Of Elements
4
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
4 Channels
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
b
2
D
e
E1
A2
Dimension Limits
E
c
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
b
MCP6541/1R/1U/2/3/4
0.75
0.00
0.40
0.08
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
DS21696F-page 25