MCP6544-E/SL Microchip Technology, MCP6544-E/SL Datasheet - Page 23
![IC COMP 1.6V QUAD P-P 14SOIC](/photos/6/59/65933/150-14-soic_sml.jpg)
MCP6544-E/SL
Manufacturer Part Number
MCP6544-E/SL
Description
IC COMP 1.6V QUAD P-P 14SOIC
Manufacturer
Microchip Technology
Type
General Purposer
Specifications of MCP6544-E/SL
Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
14-SOIC (0.154", 3.90mm Width)
Number Of Elements
4
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
4 Channels
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
b1
eB
E1
N
A
E
D
e
L
c
b
A2
MCP6541/1R/1U/2/3/4
.015
.290
.240
.348
.008
.040
.014
MIN
.115
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–
DS21696F-page 23