ADP1650 Analog Devices, ADP1650 Datasheet - Page 28

no-image

ADP1650

Manufacturer Part Number
ADP1650
Description
1.5 A LED Flash Driver with I2C-Compatible Interface
Manufacturer
Analog Devices
Datasheet

Specifications of ADP1650

Product Description
1.5 A LED Flash Driver with I2C-Compatible Interface
Led #
1
Led Configuration
Serial
Topology
Inductive
Application
Flash
I2c Support
Yes
Max Iout (ma)
1500mA
Brightness Control
I2C
Peak Efficiency (%)
90%
Switching Frequency
3MHz
Over Volt Protection (v)
5.5V
Vin Min (v)
2.7V
Vout (v)
4.575 to 5.425
Synchronous
Yes
Package
12-Bump WLCSP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADP1650ACBZ-R7
Manufacturer:
WLCSP
Quantity:
6 535
Part Number:
ADP1650ACBZ-R7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADP1650
PCB LAYOUT
Poor layout can affect performance, causing electromagnetic
interference (EMI) and electromagnetic compatibility (EMC)
problems, ground bounce, and power losses. Poor layout can
also affect regulation and stability. Figure 45 shows optimized
layouts implemented using the following guidelines:
Place the inductor, input capacitor, and output capacitor
close to the IC using short tracks. These components carry
high switching frequencies and large currents.
Route the trace from the inductor to the SW pin with as
wide a trace as possible. The easiest path is through the
center of the output capacitor.
Route the LED_OUT path away from the inductor and SW
node to minimize noise and magnetic interference.
Figure 46. Example Layout of the ADP1650 Driving a High Power White LED (LFCSP)
Figure 45. Layout of the ADP1650 Driving a High Power White LED (WLCSP)
ADP1650
AREA = 16.4mm
L1
VIN
GPIO2
SDA
SCL
INDUCTOR
C1
Li-ION +
PGND
GND
PGND
2
Rev. C | Page 28 of 32
LED_OUT
STROBE
C2
VOUT
SW
EN
ANODE
PGND
LED
Maximize the size of ground metal on the component side
to help with thermal dissipation.
Use a ground plane with two to three vias connecting to the
component side ground near the output capacitor to
reduce noise interference on sensitive circuit nodes.
With the LFCSP package, six to eight thermal vias connect
the ground paddle to the main PCB ground plane.
Analog Devices applications engineers can be contacted
through the Analog Devices sales team to discuss different
layouts based on system design constraints.
INDUCTOR
C2
Li-ION +
Li-ION +
L1
DIGITAL
INPUT/
OUTPUT
VOUT

Related parts for ADP1650