AD7805 Analog Devices, AD7805 Datasheet - Page 6

• Manufacturer Part Number: AD7805
• Description: +3.3 V to +5 V Quad/Octal 10-Bit DAC
• Manufacturer: Analog Devices

Specifications of AD7805

• Resolution (bits): 10bit
• Dac Update Rate: 667kSPS
• Dac Settling Time: 1.5µs
• Max Pos Supply (v): +5.5V
• Single-supply: Yes
• Dac Type: Voltage Out
• Dac Input Format: Par

AD7804/AD7805/AD7808/AD7809
ABSOLUTE MAXIMUM RATINGS
(T
DV
AV
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to DV
Analog Input Voltage to AGND . . . . . –0.3 V to AV
COMP to AGND . . . . . . . . . . . . . . . –0.3 V to AV
REF OUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to + AV
REF IN to AGND . . . . . . . . . . . . . . . –0.3 V to AV
V
Input Current to Any Pin Except Supplies
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW
PDIP (N-16) Package, Power Dissipation . . . . . . . . . 670 mW
SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW
Model
AD7804BN
AD7804BR
AD7805BN
AD7805BR
AD7805BRS
AD7805CR
AD7808BN
AD7808BR
AD7809BST
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
OUT
A
AD7804/AD7805 Commercial Plastic
AD7808/AD7809 Commercial Plastic
Lead Temperature, Soldering
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 C
Lead Temperature, Soldering
DD
JA
JA
JA
DD
= +25 C unless otherwise noted)
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40 C to +85 C
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40 C to +85 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75 C/W
to AGND
to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
2
Supply
Voltage
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
. . . . . . . . . . . . . . . . –0.3 V to AV
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
1
3
. . . . . . . . 10 mA
DD
DD
DD
DD
DD
ORDERING GUIDE
Relative
Accuracy
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
3 LSB
3 LSB
3 LSB
3 LSB
3 LSB
3 LSB
4 LSB
4 LSB
4 LSB
DD
–6–
PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW
SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW
PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW
SSOP (RS-28) Package, Power Dissipation . . . . . . . . 875 mW
TQFP (SU-44) Package, Power Dissipation . . . . . .
NOTES
1
2
3
Stresses above those listed under Absolute Maximum Ratings may cause perma-
The outputs may be shorted to voltages in this range provided the power dissipation
Transient currents of up to 100 mA will not cause SCR latch-up.
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
of the package is not exceeded.
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 C
Lead Temperature, Soldering
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 C
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
JA
JA
JA
24-Lead Plastic DIP
24 Lead Small Outline IC
Package Descriptions
16-Lead Plastic DIP
16-Lead Small Outline IC
28-Lead Plastic DIP
28 Lead Small Outline IC
28-Lead Shrink Small Outline Package
28-Lead Small Outline IC
44-Lead Thin Plastic Quad Flatpack (TQFP)
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116 C/W
WARNING!
ESD SENSITIVE DEVICE
Package
N-24
R-24
Options
N-16
R-16
N-28
R-28
RS-28
R-28
SU-44
450 mW
REV. A