SAM3U4C Atmel Corporation, SAM3U4C Datasheet - Page 54

• Manufacturer Part Number: SAM3U4C
• Manufacturer: Atmel Corporation

Specifications of SAM3U4C

• Flash (kbytes): 256 Kbytes
• Pin Count: 100
• Max. Operating Frequency: 96 MHz
• Cpu: Cortex-M3
• # Of Touch Channels: 28
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 57
• Ext Interrupts: 57
• Usb Transceiver: 1
• Quadrature Decoder Channels: 1
• Usb Speed: Hi-Speed
• Usb Interface: Device
• Spi: 4
• Twi (i2c): 1
• Uart: 4
• Ssc: 1
• Sd / Emmc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 8
• Adc Resolution (bits): 12
• Adc Speed (ksps): 384
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 50
• Self Program Memory: YES
• External Bus Interface: 1
• Dram Memory: No
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.62 to 3.6
• Fpu: No
• Mpu / Mmu: Yes / No
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

Figure 13-3. 144-lead LQFP Package Drawing
Notes:
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1. This drawing is for general information only; refer to JEDEe Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum
4. b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between pro-
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
SAM3U Series
plastic body size dimensions including mold mismatch.
trusion and an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
6430ES–ATARM–22-Aug-11