SAM3N4B Atmel Corporation, SAM3N4B Datasheet - Page 712

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SAM3N4B

Manufacturer Part Number
SAM3N4B
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM3N4B

Flash (kbytes)
256 Kbytes
Pin Count
64
Max. Operating Frequency
48 MHz
Cpu
Cortex-M3
# Of Touch Channels
32
Hardware Qtouch Acquisition
No
Max I/o Pins
79
Ext Interrupts
79
Quadrature Decoder Channels
2
Usb Speed
No
Usb Interface
No
Spi
3
Twi (i2c)
2
Uart
4
Ssc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
10
Adc Resolution (bits)
10
Adc Speed (ksps)
384
Resistive Touch Screen
No
Dac Channels
1
Dac Resolution (bits)
10
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
24
Self Program Memory
YES
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
no / no
Timers
6
Output Compare Channels
6
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
35.4.6
Table 35-20. 3 to 20 MHz Crystal Oscillator Characteristics
Notes:
Where
712
Symbol
F
F
T
I
P
R
C
C
DD_ON
req
req_bypass
ON
ON
f
LEXT
L
C
1. R
2. Rs = 100-200 Ohms; Cs = 2.0 - 2.5pF; Cm = 2 – 1.5 fF(typ, worst case) using 1 KΩ serial resistor on XOUT.
3. Rs = 50-100 Ohms; Cs = 2.0 - 2.5pF; Cm = 4 - 3 fF(typ, worst case).
4. Rs = 25-50 Ohms; Cs = 2.5 - 3.0pF; Cm = 7 - 5 fF (typ, worst case).
5. Rs = 20-50 Ohms; Cs = 3.2 - 4.0pF; Cm = 10 - 8 fF(typ, worst case).
PCB
SAM3N
3 to 20 MHz Crystal Oscillator Characteristics
is the capacitance of the printed circuit board (PCB) track layout from the crystal to the SAM3 pin.
S
is the series resistor
Parameter
Operating Frequency
Operating Frequency In Bypass Mode
Supply Ripple Voltage (on VDDPLL)
Duty Cycle
Startup Time
Current consumption
Drive level
Internal resistor
Maximum external capacitor
on XIN and XOUT
Internal Equivalent Load Capacitance
C
XIN
LEXT
C
LEXT
= 2x(
C
SAM3
Crystal
Conditions
Normal mode with crystal
External Clock on XIN
Rms value, 10 KHz to 10 MHz
3 MHz, C
8 MHz, C
12 to 16 MHz, C
20 MHz, C
3 MHz
8 MHz
12 to 16 MHz
20 MHz
3 MHz
8 MHz
12 MHz, 16 MHz, 20 MHz
between XIN and XOUT
Integrated Load Capacitance
(XIN and XOUT in series)
C
CRYSTAL
C
L
(2)
(3)
(5)
SHUNT
SHUNT
SHUNT
C
(4)
R=1K if Crystal Frequency
C
XOUT
L
= 3pF
= 7pF
LEXT
is lower than 8MHz
SHUNT
= 7pF
C
PCB
= 7pF
)
12.5
Min
7.5
40
3
Typ
150
200
250
350
9.5
16
50
1
11011A–ATARM–04-Oct-10
Max
14.5
17.5
11.5
230
300
350
450
1.4
20
50
30
60
15
30
50
4
1
MHz
MHz
Unit
mV
µW
ms
µA
pF
pF
%

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