AT32UC3C264C Atmel Corporation, AT32UC3C264C Datasheet - Page 90

• Manufacturer Part Number: AT32UC3C264C
• Manufacturer: Atmel Corporation

Specifications of AT32UC3C264C

• Flash (kbytes): 64 Kbytes
• Pin Count: 64
• Max. Operating Frequency: 66 MHz
• Cpu: 32-bit AVR
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 45
• Ext Interrupts: 64
• Usb Transceiver: 1
• Quadrature Decoder Channels: 1
• Usb Speed: Full Speed
• Usb Interface: Device + OTG
• Spi: 5
• Twi (i2c): 2
• Uart: 4
• Can: 2
• Lin: 4
• Ssc: 1
• Ethernet: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 11
• Adc Resolution (bits): 12
• Adc Speed (ksps): 2000
• Analog Comparators: 2
• Resistive Touch Screen: No
• Dac Channels: 2
• Dac Resolution (bits): 12
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 20
• Self Program Memory: YES
• Dram Memory: No
• Nand Interface: No
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 3.0 to 3.6 or 4.5 to 5.5
• Operating Voltage (vcc): 3.0 to 3.6 or 4.5 to 5.5
• Fpu: Yes
• Mpu / Mmu: Yes / No
• Timers: 3
• Output Compare Channels: 13
• Input Capture Channels: 6
• Pwm Channels: 14
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

8. Mechanical Characteristics
8.1
8.1.1
8.1.2
32117CS–AVR-08/11
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
JA
JC
90.
Table 8-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
90.
θ
HEATSINK
JA
)
51.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
No air flow
No air flow
No air flow
No air flow
TQFP100
TQFP100
LQFP144
LQFP144
Package
TQFP64
TQFP64
QFN64
QFN64
AT32UC3C
Table 8-1 on page
20.0
40.5
39.3
38.1
Typ
0.8
8.7
8.5
8.4
”Power
J
°C/W
°C/W
°C/W
°C/W
in °C.
Unit
90